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CS35N10FA9 PDF预览

CS35N10FA9

更新时间: 2024-06-27 12:13:40
品牌 Logo 应用领域
华润微 - CRMICRO /
页数 文件大小 规格书
10页 1161K
描述
TO-220F

CS35N10FA9 数据手册

 浏览型号CS35N10FA9的Datasheet PDF文件第2页浏览型号CS35N10FA9的Datasheet PDF文件第3页浏览型号CS35N10FA9的Datasheet PDF文件第4页浏览型号CS35N10FA9的Datasheet PDF文件第5页浏览型号CS35N10FA9的Datasheet PDF文件第6页浏览型号CS35N10FA9的Datasheet PDF文件第7页 
Silicon N-Channel Power MOSFET  
CS35N10FA9  
R
General Description  
VDSS  
100  
35  
V
CS35N10F A9, the silicon N-channel Enhanced  
VDMOSFETs, is obtained by the high density Trench  
technology which reduce the conduction loss, improve switching  
performance and enhance the avalanche energy. This device is  
suitable for use as a load switch and PWM applications. The  
package form is TO-220F, which accords with the RoHS standard.  
Features  
ID  
A
W
PD  
36.7  
12  
RDS(ON)Typ  
mΩ  
Fast Switching  
Low ON Resistance(Rdson≤15 mΩ)  
Low Gate Charge  
Low Reverse transfer capacitances  
100% Single Pulse avalanche energy Test  
Applications:  
Power switch circuit of adaptor and charger.  
AbsoluteTj= 25unless otherwise specified)  
Parameter  
Symbol  
VDSS  
Rating  
Units  
Drain-to-Source Voltage  
100  
V
A
Continuous Drain Current TC = 25 °C  
Continuous Drain Current TC = 100 °C  
Pulsed Drain Current TC = 25 °C  
Gate-to-Source Voltage  
35  
ID  
22  
A
a1  
140  
A
IDM  
VGS  
±20  
V
a2  
Avalanche Energy  
295.8  
mJ  
V/ns  
W
EAS  
a3  
Peak Diode Recovery dv/dt  
9.6  
36.7  
dv/dt  
Power Dissipation TC = 25 °C  
Derating Factor above 25°C  
PD  
0.29  
W/℃  
Operating Junction and Storage Temperature Range  
MaximumTemperature for Soldering  
TJTstg  
15055 to 150  
300  
TL  
WUXI CHINA RESOURCES HUAJING MICROELECTRONICS CO., LTD. Page 1 of 10  
2020V01  

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