Datasheet > CRS14(TE85L,Q)

CRS14(TE85L,Q)

更新时间： 2024-11-06 20:04:43

品牌	Logo	应用领域
东芝 - TOSHIBA		二极管
页数	文件大小	规格书
6页	185K
描述
RECTIFIER DIODE,SCHOTTKY,30V V(RRM),UMD2VAR

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技术参数
数据手册

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CRS14(TE85L,Q) 技术参数

是否Rohs认证：	符合	生命周期：	Obsolete
Reach Compliance Code：	unknown	ECCN代码：	EAR99
HTS代码：	8541.10.00.80	风险等级：	5.84
配置：	SINGLE	二极管类型：	RECTIFIER DIODE
最大正向电压 (VF)：	0.49 V	最大非重复峰值正向电流：	30 A
元件数量：	1	最高工作温度：	150 °C
最大输出电流：	2 A	最大重复峰值反向电压：	30 V
子类别：	Rectifier Diodes	表面贴装：	YES
技术：	SCHOTTKY	Base Number Matches：	1

CRS14(TE85L,Q) 数据手册

CRS14

TOSHIBA Schottky Barrier Rectifier Schottky Barrier Type

CRS14

Switching Mode Power Supply Applications

Unit: mm

Portable Equipment Battery Applications

②

•

Forward voltage: V

= 0.49 V (max) @ I = 2.0 A

FM F

Average forward current: I

= 2.0 A

F (AV)

Repetitive peak reverse voltage: V

= 30 V

RRM

Suitable for high-density board assembly due to the use of a small

surface-mount package, “S-FLAT

”

0.9 ± 0.1

0.16

Absolute Maximum Ratings (Ta = 25°C)

+ 0.2

− 0.1

①

1.6

Characteristics

Symbol

Rating

Unit

Repetitive peak reverse voltage

Average forward current

RRM

① ANODE

② CATHODE

2.0 (Note 1)

F (AV)

Peak one cycle surge forward current

(non-repetitive)

30 (50 Hz)

FSM

JEDEC

JEITA

⎯

Junction temperature

Storage temperature

−40 to 150

°C

stg

TOSHIBA

3-2A1A

Note 1: Ta = 64°C : Device mounted on a ceramic board

Board size : 50 mm × 50 mm

Weight: 0.013 g (typ.)

Soldering size : 2 mm × 2 mm

Board thickness : 0.64 mm

Rectangular waveform (α = 180°), V = 15 V

Note 2: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the

significant change in temperature, etc.) may cause this product to decrease in the reliability significantly

even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute

maximum ratings.

Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook

(“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test

report and estimated failure rate, etc).

2009-04-20

12 3 4 5 6

中文翻译

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