CRS10I30B
TOSHIBA Schottky Barrier Diode
CRS10I30B
Secondary Rectification in Switching Regulators
Unit: mm
Reverse-Current Protection in Mobile Devices
•
•
•
•
Repetitive peak reverse voltage : V
= 30 V
= 1.0 A
RRM
Average forward current
Peak forward voltage
: I
F (AV)
: V
= 0.42 V (max) @ I
FM
= 1.0 A
FM
Small, thin package suitable for high-density board assembly
TM
Toshiba Nickname: “S-FLAT
”
Absolute Maximum Ratings (Ta = 25°C)
Characteristics
Symbol
Rating
30
Unit
V
Repetitive peak reverse voltage
Average forward current
V
RRM
I
1.0 (Note 1)
20 (50 Hz)
150
A
A
F (AV)
1
2
ANODE
Non-repetitive peak forward surge current
Junction temperature
I
FSM
CATHODE
T
°C
°C
j
Storage temperature
T
-55 to 150
stg
JEDEC
JEITA
Note 1: Ta = 51°C
Device mounted on a glass-epoxy board
Board size
: 50 mm × 50 mm
: 6 mm × 6 mm
: 1.6 mm
Soldering land size
Board thickness
TOSHIBA
3-2A1S
Rectangular waveform : α = 180°, V = 15 V
R
Weight: 0.013 g (typ.)
Note 2: Using continuously under heavy loads (e.g. the application of
high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to
decrease in the reliability significantly even if the operating conditions (i.e. operating
temperature/current/voltage, etc.) are within the absolute maximum ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
(“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test
report and estimated failure rate, etc).
Electrical Characteristics (Ta = 25°C)
Characteristics
Symbol
Test Condition
= 0.1 A (pulse test)
Min
Typ.
Max
Unit
V
V
V
V
I
I
I
0.27
0.35
0.37
10
FM (1)
FM (2)
FM (3)
FM
FM
FM
Peak forward voltage
= 0.7 A (pulse test)
= 1.0 A (pulse test)
0.42
I
V
V
V
= 5.0 V (pulse test)
= 30 V (pulse test)
RRM (1)
RRM (2)
RRM
RRM
Repetitive peak reverse current
Junction capacitance
µA
I
20
60
C
j
= 10 V, f = 1.0 MHz
R
50
pF
Device mounted on a ceramic board
board size
soldering land size
board thickness
50 mm × 50 mm
2 mm × 2 mm
0.64 mm
70
Thermal resistance (junction to ambient)
Thermal resistance (junction to lead)
R
°C/W
°C/W
th (j-a)
Device mounted on a glass-epoxy board
board size 50 mm × 50 mm
soldering land size 6 mm × 6 mm
140
20
board thickness
1.6 mm
R
th (j-ℓ)
Start of commercial production
2009-11
1
2018-11-15