MEDER electronic
CRR Series
SPST Reed Relays
DESCRIPTION
The MEDER CRR Reed Relay Series is a low-profile
device made with a ceramic case that exactly matches
the thermal coefficient of expansion of the Reed Switch
glass and the reed lead to eliminate any potential
packaging stress. This Reed Relay is the smallest in the
industry and switches into the billions of operations.
FEATURES
This Relay has 1 µV typical thermal offset. Measuring
only 8.6 mm x 4.4 mm x 3.4 mm, the leadless design
eliminates skewing of leads and coplanarity issues.
Insulation resistance typical to all points is >1014 Ohms.
• Ceramic / thermoset molded package
• Patent pending
• Smallest in the industry
• No lead frame surface mount design eliminates
skewing of leads and coplanarity issues
• Available with BGA
• Internal magnetic shield standard
• Very low profile
• Gold plated leads
APPLICATIONS
• Low thermal offset typical 1 µV
• TCE matching of all internal components
• Insulation resistance typical 1014 ohms
• 3 Volt option available
• Test and measurement
• Medical equipment
• Telecommunications
DIMENSIONS (Non-BGA)
*All dimensions in mm (inch)
ꢀ.ꢀ ±±0
[±.073±±.±±ꢀ4
8.6 ±±0
[±.339±±.±±ꢀ4
1A
1B
PIN OUT
PCB LAYOUT
PAD LAYOUT
(Top View)
(Bottom View)
3.60
[0.1417]
0.50
[0.0197]
1.20
[0.0472]
Ø
0.95
[Ø 0.0031]
9
10
1
8
7
3
6
5
0.70
[0.0276]
10x R0.475
[0.187]
1.20
[0.0472]
2
4
0.95
[0.0374]
3.125
[0.123]
+
9.60
[0.378]
1A
1B
www.meder.com
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