Datasheet > CPZ28X-C5241B

CPZ28X-C5241B

更新时间： 2023-12-06 20:01:28

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CPZ28X-C5241B 数据手册

PROCESS CPZ28X

Zener Diode

0.5 Watt Zener Diode Chip

PROCESS DETAILS

Process

EPITAXIAL PLANAR

13 x 13 MILS

5.5 MILS

Die Size

Die Thickness

Anode Bonding Pad Area

Top Side Metalization

Back Side Metalization

7.0 x 7.0 MILS

Ti/Al - 13,000Å

Au-As - 9,000Å

GEOMETRY

GROSS DIE PER 5 INCH WAFER

101,184

PRINCIPAL DEVICE TYPES

CMDZ1L8 THRU CMDZ47L

CMHZ4614C THRU CMHZ4627C

CMHZ5221B THRU CMHZ5267B

CMPZ5221B THRU CMPZ5267B

CMOZ1L8 THRU CMOZ47L

BACKSIDE CATHODE

R1 (14-May 2013)

www.centralsemi.com

12 3 4

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型号	品牌	描述	获取价格	数据表
CPZ28X-C5242B	CENTRAL	Bare die,12.990 X 12.990 mils,0.5W Zener Diode	获取价格
CPZ28X-C5255B	CENTRAL	Bare die,12.990 X 12.990 mils,0.5W Zener Diode	获取价格
CPZ28X-CMPZ4626	CENTRAL	5.6V,350mW Bare die,12.990 X 12.990 mils,Diode-Zener	获取价格
CPZ28X-CMPZ5226B	CENTRAL	3.3V,350mW Bare die,12.990 X 12.990 mils,Diode-Zener	获取价格
CPZ28X-CMPZ5227B	CENTRAL	3.6V,350mW Bare die,12.990 X 12.990 mils,Diode-Zener	获取价格
CPZ28X-CMPZ5228B	CENTRAL	3.9V,350mW Bare die,12.990 X 12.990 mils,Diode-Zener	获取价格