FACTSHEET F-201
CPC2–028–F–03–SG
CPC2–020–S–01–SG
CPC4–128–S–SG
CPC4–064–S–SG
CPC2–016–S–02–SG–CU
CPC2, CPC4 SERIES
CHIP PACKAGE
S P ECIFICATIONS
LEAD
BODY
NO. OF
PLATING
OTHER
OPTION
CPC2
POSITIONS
PITCH
STYLE
OPTION
Materials:
Insulator Material:
Liquid Crystal Polymer
Contact Material:
Specify
Phosphor Bronze
Leave blank
for Cavity
Down
–SG
–S
Operating Temp Range:
BODY
= 30µ"
(0,76µm)
= (0,64mm)
-65°C to +105°C with Tin;
004, 008, 010, 016,
STYLE
.025" Pitch
-65°C to +125°C with Gold
from
Plating:
Soft Gold
(.9999 pure)
020, 024, 028
–CU
Au over 50µ"
chart
–F
(1,27µm) Ni
= Cavity
Up
No. of positions x pitch / 2
= (1,27mm)
+ (3,81) .150
Current Rating:
.050" Pitch
No. of positions x
pitch / 2 + (1,50) .059
Testing Now!
BODY
STYLE
Max Processing Temp:
A
B
C
No. of positions
–LDC
230°C for 60 seconds
SMT Lead Coplanarity:
(0,10mm) .004" max
x pitch / 2
LEAD
PITCH
(3,81) (7,54) (9,68)
.150 .297 .381
= (1,52mm)
.060" thick
cupped
+ (0,08) .003
D
–01
(0,64)
.025
(1,27)
.050
(7,62) (11,35) (13,49)
.300 .447 .531
(12,70) (16,43) (18,57)
.500 .647 .731
–S
–F
–02
–03
lid with
(0,76mm)
.030" cavity
B
A
C
–LDF
(2,31)
.091
= (0,76mm)
.030" thick
flat lid
(1,65)
.065
(2,79)
.110
(0,71)
.028 TYP
(0,81)
.032
–CU Option
(Cavity up)
(0,20)
.008
(1,14)
.045
D
ALS O AVAILABLE
Standard Option
(Cavity down)
Optional
lids for
chip/wire
bond
protection.
PLATING
OPTION
OTHER
OPTION
NO. OF POSITIONS
S
CPC4
Leave blank for
Cavity Down
–SG
= 30µ" (0,76µm)
Soft Gold
–064, –128
–CU
(.9999 pure)
= Cavity Up
C (SQ)
–LDC
B (SQ)
A (SQ)
NO. OF
A
B
C
= (1,52mm) .060"
thick cupped
lid with
POSITIONS
(12,01) (15,75) (17,88)
.473 .620 .704
(21,67) (25,40) (27,53)
.853 1.000 1.084
064
(0,76mm) .030"
cavity
128
–LDF
= (0,76mm) .030"
thick flat lid
(0,20)
.008
–CU Option
(Cavity up)
(0,64)
.025
(1,14)
.045
(2,79)
.110
(1,65)
.065
(0,81)
.032
Standard Option
(Cavity down)
Note: Some sizes, styles and
options are non-standard,
non-returnable.
Due to technical progress, all designs, specifications and components are subject to change without notice.
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