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CPA2512E1000FS-T10 PDF预览

CPA2512E1000FS-T10

更新时间: 2024-11-20 22:57:35
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其他 - ETC /
页数 文件大小 规格书
3页 548K
描述
RES SMD 100 OHM 1% 16W 2512

CPA2512E1000FS-T10 数据手册

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Page 1 of 3  
CPA Series (2512)  
Construction:  
Features:  
High Purity Alumina ceramic  
Nickel alloy thin-film resistive element  
Epoxy-resin overcoat  
Pre-tinned (Sn100, matte) terminations over  
Ni barrier is standard (RoHS and Pb Free)  
Halogen Free  
TCR’s to ± 25ppm/ºC  
Tolerances less than ± 1% available  
Standard and custom sizes & terminations  
available (Sn60Pb40 option)  
High volume production, suitable for  
commercial and special applications  
Competitive pricing  
Description:  
These power resistors are designed to tolerate high current and establish a low thermal resistance interface with the circuit board. A  
lower thermal resistance more efficiently sinks heat to the board, enabling a larger effective area for heat dissipation. As a result,  
much lower surface temperatures are achievable in comparison to standard chip resistors for the same chip size and applied power.  
Dimensions:  
Size  
Metric  
6332  
Standard Dimensions (mm)  
Inch  
2512  
L
W
H
T-top  
T-btm  
6.3 ± 0.2  
3.2 ± 0.2  
0.7± 0.1  
0.9 ± 0.2 2.0 ± 0.2  
Call for other sizes and/or termination styles  
Electrical Specifications:  
Size: Inch (Metric)  
Rated Power 1, 2  
CPA2512 Derating Curve Examples: 6  
2512 (6332)  
Up to 16W 1, 2  
(PxR)  
Rated Voltage  
Resistance Tolerance  
± 1%  
3.3 to 120  
Standard Resistance Values (E12)  
TCR (ppm/ºC) 3  
Call for other values  
22 thru 120  
± 25 (E)  
± 50 (Q)  
3.3 thru 20 Ω  
Operating Temperature Range 4  
Insulation Resistance (100V, 1min) 5  
Notes:  
-55 to 155ºC  
> 1GΩ  
1. Dependent on effective thermal conductivity/resistance of board construction/land design and size of board - greater power  
capability for board/land with lower thermal resistance. For relatively high thermal resistance mountings, the power resistors are  
capable of generating sufficient heat to reflow solder bonds without device damage.  
2. Refer to Thermal Performance Plot below.  
3. Per MIL-PRF-55342 (-55/25/125ºC).  
4. Per MIL-PRF-55342.  
5. Per IEC 60115-1.  
6. Derating curves are derived from the thermal performance plots.  

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