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CPA Series (2512)
Construction:
Features:
High Purity Alumina ceramic
Nickel alloy thin-film resistive element
Epoxy-resin overcoat
Pre-tinned (Sn100, matte) terminations over
Ni barrier is standard (RoHS and Pb Free)
Halogen Free
TCR’s to ± 25ppm/ºC
Tolerances less than ± 1% available
Standard and custom sizes & terminations
available (Sn60Pb40 option)
High volume production, suitable for
commercial and special applications
Competitive pricing
Description:
These power resistors are designed to tolerate high current and establish a low thermal resistance interface with the circuit board. A
lower thermal resistance more efficiently sinks heat to the board, enabling a larger effective area for heat dissipation. As a result,
much lower surface temperatures are achievable in comparison to standard chip resistors for the same chip size and applied power.
Dimensions:
Size
Metric
6332
Standard Dimensions (mm)
Inch
2512
L
W
H
T-top
T-btm
6.3 ± 0.2
3.2 ± 0.2
0.7± 0.1
0.9 ± 0.2 2.0 ± 0.2
Call for other sizes and/or termination styles
Electrical Specifications:
Size: Inch (Metric)
Rated Power 1, 2
CPA2512 Derating Curve Examples: 6
2512 (6332)
Up to 16W 1, 2
√(PxR)
Rated Voltage
Resistance Tolerance
± 1%
3.3 to 120 Ω
Standard Resistance Values (E12)
TCR (ppm/ºC) 3
Call for other values
22 thru 120 Ω
± 25 (E)
± 50 (Q)
3.3 thru 20 Ω
Operating Temperature Range 4
Insulation Resistance (100V, 1min) 5
Notes:
-55 to 155ºC
> 1GΩ
1. Dependent on effective thermal conductivity/resistance of board construction/land design and size of board - greater power
capability for board/land with lower thermal resistance. For relatively high thermal resistance mountings, the power resistors are
capable of generating sufficient heat to reflow solder bonds without device damage.
2. Refer to Thermal Performance Plot below.
3. Per MIL-PRF-55342 (-55/25/125ºC).
4. Per MIL-PRF-55342.
5. Per IEC 60115-1.
6. Derating curves are derived from the thermal performance plots.