Datasheet > CP710-MPSA94-WS

CP710-MPSA94-WS

更新时间： 2024-10-02 10:41:11

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CP710-MPSA94-WS 数据手册

PROCESS CP710

Small Signal Transistor

PNP - High Voltage Transistor Chip

PROCESS DETAILS

Process

EPITAXIAL PLANAR

Die Size

26 x 26 MILS

9.0 MILS

Die Thickness

Base Bonding Pad Area

Emitter Bonding Pad Area

Top Side Metalization

Back Side Metalization

6.1 x 4.9 MILS

5.2 x 5.2 MILS

Al - 30,000Å

Au - 18,000Å

GEOMETRY

GROSS DIE PER 4 INCH WAFER

16,880

PRINCIPAL DEVICE TYPES

CMPTA94

CXTA94

CZTA94

MPSA94

BACKSIDE COLLECTOR

145 Adams Avenue

Hauppauge, NY 11788 USA

Tel: (631) 435-1110

Fax: (631) 435-1824

www.centralsemi.com

R3 (23-August 2006)

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