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CP616 PDF预览

CP616

更新时间: 2024-09-30 03:26:23
品牌 Logo 应用领域
CENTRAL 晶体晶体管射频
页数 文件大小 规格书
2页 205K
描述
Small Signal Transistor PNP - Silicon RF Transistor Chip

CP616 数据手册

 浏览型号CP616的Datasheet PDF文件第2页 
TM  
PROCESS CP616  
Small Signal Transistor  
PNP - Silicon RF Transistor Chip  
Central  
Semiconductor Corp.  
PROCESS DETAILS  
Process  
EPITAXIAL PLANAR  
Die Size  
Die Thickness  
21.7 x 21.7 MILS  
9.0 MILS  
Base Bonding Pad Area  
Emitter Bonding Pad Area  
Top Side Metalization  
Back Side Metalization  
3.5 MILS DIAMETER  
3.5 x 3.5 MILS  
Al - 30,000Å  
Au - 10,000Å  
GEOMETRY  
GROSS DIE PER 4 INCH WAFER  
24,790  
PRINCIPAL DEVICE TYPES  
CM5160  
BACKSIDE COLLECTOR  
145 Adams Avenue  
Hauppauge, NY 11788 USA  
Tel: (631) 435-1110  
Fax: (631) 435-1824  
www.centralsemi.com  
R2 (1-August 2002)  

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