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CP319-CZTA44HC-CT PDF预览

CP319-CZTA44HC-CT

更新时间: 2024-09-17 14:41:31
品牌 Logo 应用领域
CENTRAL /
页数 文件大小 规格书
2页 215K
描述
Transistor

CP319-CZTA44HC-CT 技术参数

生命周期:Obsolete包装说明:,
Reach Compliance Code:compliant风险等级:5.84
Base Number Matches:1

CP319-CZTA44HC-CT 数据手册

 浏览型号CP319-CZTA44HC-CT的Datasheet PDF文件第2页 
TM  
PROCESS CP319  
Power Transistor  
Central  
Semiconductor Corp.  
NPN - Silicon Power Transistor Chip  
PROCESS DETAILS  
Process  
EPITAXIAL PLANAR  
Die Size  
Die Thickness  
87 x 87 MILS  
9.0 MILS  
Base Bonding Pad Area  
Emitter Bonding Pad Area  
Top Side Metalization  
Back Side Metalization  
24 x 15 MILS  
38 x 16 MILS  
Al - 30,000Å  
Ti/Ni/Ag - 11,000Å  
GEOMETRY  
GROSS DIE PER 4 INCH WAFER  
1,460  
PRINCIPAL DEVICE TYPES  
CZTA44HC  
TIP47  
TIP48  
TIP50  
BACKSIDE COLLECTOR  
145 Adams Avenue  
Hauppauge, NY 11788 USA  
Tel: (631) 435-1110  
Fax: (631) 435-1824  
www.centralsemi.com  
R2 (21-September 2003)