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CP310-MPSA44-CG PDF预览

CP310-MPSA44-CG

更新时间: 2024-11-22 09:11:35
品牌 Logo 应用领域
CENTRAL /
页数 文件大小 规格书
2页 216K
描述
Transistor

CP310-MPSA44-CG 数据手册

 浏览型号CP310-MPSA44-CG的Datasheet PDF文件第2页 
TM  
PROCESS CP310  
Small Signal Transistor  
NPN - High Voltage Transistor Chip  
Central  
Semiconductor Corp.  
PROCESS DETAILS  
Process  
EPITAXIAL PLANAR  
Die Size  
Die Thickness  
26 x 26 MILS  
9.0 MILS  
Base Bonding Pad Area  
Emitter Bonding Pad Area  
Top Side Metalization  
Back Side Metalization  
6.1 x 4.9 MILS  
5.2 x 5.2 MILS  
Al - 30,000Å  
Au - 18,000Å  
GEOMETRY  
GROSS DIE PER 4 INCH WAFER  
16,880  
PRINCIPAL DEVICE TYPES  
2N3439  
2N3440  
CMPTA42  
CMPTA44  
CMPT6517  
CXTA44  
CZTA42  
CZTA44  
MPSA42  
MPSA44  
BACKSIDE COLLECTOR  
145 Adams Avenue  
Hauppauge, NY 11788 USA  
Tel: (631) 435-1110  
Fax: (631) 435-1824  
www.centralsemi.com  
R2 (1-August 2002)  

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