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CMZ15 PDF预览

CMZ15

更新时间: 2024-11-29 03:26:07
品牌 Logo 应用领域
东芝 - TOSHIBA 瞬态抑制器二极管齐纳二极管测试光电二极管
页数 文件大小 规格书
5页 174K
描述
Constant Voltage Regulation Transient Suppressors

CMZ15 技术参数

是否无铅: 含铅是否Rohs认证: 不符合
生命周期:Active包装说明:R-PDSO-F2
针数:2Reach Compliance Code:unknown
ECCN代码:EAR99HTS代码:8541.10.00.50
风险等级:5.59Is Samacsys:N
配置:SINGLE二极管元件材料:SILICON
二极管类型:ZENER DIODEJESD-30 代码:R-PDSO-F2
元件数量:1端子数量:2
最高工作温度:150 °C最低工作温度:-40 °C
封装主体材料:PLASTIC/EPOXY封装形状:RECTANGULAR
封装形式:SMALL OUTLINE峰值回流温度(摄氏度):NOT SPECIFIED
极性:UNIDIRECTIONAL最大功率耗散:2 W
认证状态:Not Qualified标称参考电压:15 V
子类别:Voltage Reference Diodes表面贴装:YES
技术:ZENER端子形式:FLAT
端子位置:DUAL处于峰值回流温度下的最长时间:NOT SPECIFIED
最大电压容差:10%工作测试电流:10 mA
Base Number Matches:1

CMZ15 数据手册

 浏览型号CMZ15的Datasheet PDF文件第2页浏览型号CMZ15的Datasheet PDF文件第3页浏览型号CMZ15的Datasheet PDF文件第4页浏览型号CMZ15的Datasheet PDF文件第5页 
CMZ12~CMZ53  
TOSHIBA Zener Diode Silicon Diffused Type  
CMZ12~CMZ53  
Applications:  
Unit: mm  
Communication, Control and  
Measurement Equipment  
Constant Voltage Regulation  
Transient Suppressors  
Average power dissipation  
Zener voltage  
: P = 2.0 W  
: V = 12 V ~ 53 V  
Z
Suitable for compact assembly due to small surface-mount package  
TM  
“MFLAT ” (Toshiba package name)  
Absolute Maximum Ratings (Ta = 25°C)  
Characteristics  
Power dissipation  
Symbol  
P
Rating  
Unit  
2.0 (Note 1)  
40~150  
W
°C  
°C  
Junction temperature  
T
j
Storage temperature range  
T
stg  
40~150  
JEDEC  
JEITA  
Note 1: Ta = 30°C  
Device mounted on a ceramic board  
Board size: 50 mm × 50 mm  
Soldering size: 2 mm × 2 mm  
Board thickness: 0.64 t  
TOSHIBA  
3-4E1A  
Weight: 0.023 g (typ.)  
Note 2: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the  
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly  
even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute  
maximum ratings.  
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook  
(“Handling Precautions”/Derating Concept and Methods) and individual reliability data (i.e. reliability test  
report and estimated failure rate, etc).  
Standard Soldering Pad  
Unit: mm  
1.4  
3.0  
1.4  
1
2006-11-09  

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