Datasheet > CMS08_06

CMS08_06

更新时间： 2022-04-23 23:00:11

品牌	Logo	应用领域
东芝 - TOSHIBA		开关
页数	文件大小	规格书
5页	158K
描述
Switching Mode Power Supply Applications

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CMS08_06 数据手册

CMS08

TOSHIBA Schottky Barrier Rectifier Schottky Barrier Type

CMS08

Switching Mode Power Supply Applications

Unit: mm

Portable Equipment Battery Applications

•

Forward voltage: V

Average forward current: I

Repetitive peak reverse voltage: V

Suitable for compact assembly due to small surface-mount package

= 0.37 V (max)

= 1.0 A

F (AV)

= 30 V

RRM

“M−FLAT^TM” (Toshiba package name)

Absolute Maximum Ratings (Ta = 25°C)

Characteristics

Symbol

Rating

Unit

Repetitive peak reverse voltage

RRM

1.0

(Ta = 51°C)

F (AV)

(Note 1)

Average forward current

1.0

(Tℓ = 106°C)

F (AV)

Peak one cycle surge forward current

(non-repetitive)

25 (50 Hz)

FSM

JEDEC

JEITA

―

Junction temperature

Storage temperature

−40~125

−40~150

°C

stg

TOSHIBA

3-4E1A

Weight: 0.023 g (typ.)

Note 1: Device mounted on a ceramic board

(board size: 50 mm × 50 mm, soldering land: 2 mm × 2 mm)

Note 2: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the

significant change in temperature, etc.) may cause this product to decrease in the reliability significantly

even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute

maximum ratings.

Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook

(“Handling Precautions”/Derating Concept and Methods) and individual reliability data (i.e. reliability test

report and estimated failure rate, etc).

Electrical Characteristics (Ta = 25°C)

Characteristics

Symbol

Test Condition

Min

Typ.

Max

Unit

= 0.1 A

= 0.5 A

= 1.0 A

⎯

0.23

0.29

0.32

0.04

0.38

⎯

FM (1)

FM (2)

FM (3)

Peak forward voltage

0.37

⎯

= 5 V

RRM

Repetitive peak reverse current

Junction capacitance

= 30 V

1.5

⎯

= 10 V, f = 1.0 MHz

Device mounted on a ceramic board

(soldering land: 2 mm × 2 mm)

⎯

Thermal resistance

°C/W

th (j-a)

Device mounted on a glass-epoxy

board

⎯

135

(soldering land: 6 mm × 6 mm)

⎯

th (j-ℓ)

2006-11-13

12 3 4 5

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