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CMS06_06

更新时间： 2022-04-23 23:00:11
品牌 Logo 应用领域
东芝 - TOSHIBA 开关
页数 文件大小 规格书
5页 157K
描述
Switching Mode Power Supply Applications

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中文翻译

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CMS06_06 数据手册

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CMS06  
TOSHIBA Schottky Barrier Rectifier Schottky Barrier Type  
CMS06  
Switching Mode Power Supply Applications  
Unit: mm  
Portable Equipment Battery Applications  
•
•
•
•
Forward voltage: V  
Average forward current: I  
Repetitive peak reverse voltage: V  
Suitable for compact assembly due to small surface-mount package  
= 0.37 V (max)  
FM  
= 2.0 A  
F (AV)  
= 30 V  
RRM  
“M−FLATTM” (Toshiba package name)  
Absolute Maximum Ratings (Ta = 25°C)  
Characteristics  
Repetitive peak reverse voltage  
Average forward current  
Symbol  
Rating  
Unit  
V
V
30  
RRM  
2.0  
(Note 1)  
I
A
F (AV)  
Peak one cycle surge forward current  
(non-repetitive)  
I
40 (50 Hz)  
A
FSM  
Junction temperature  
T
j
−40~125  
−40~150  
°C  
°C  
JEDEC  
JEITA  
―
―
Storage temperature  
T
stg  
TOSHIBA  
3-4E1A  
Note 1: Tℓ = 82.8°C: Rectangular waveform (α = 180°), V = 15 V  
R
Weight: 0.023 g (typ.)  
Note 2: Using continuously under heavy loads (e.g. the application of  
high temperature/current/voltage and the significant change in  
temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating  
conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings.  
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook  
(“Handling Precautions”/Derating Concept and Methods) and individual reliability data (i.e. reliability test  
report and estimated failure rate, etc).  
Electrical Characteristics (Ta = 25°C)  
Characteristics  
Symbol  
Test Condition  
Min  
Typ.  
Max  
Unit  
V
V
V
V
I
I
I
= 0.5 A  
= 1.0 A  
= 2.0 A  
⎯
⎯
⎯
⎯
⎯
⎯
0.26  
0.28  
0.32  
0.09  
1.4  
⎯
⎯
FM (1)  
FM (2)  
FM (3)  
FM  
FM  
FM  
Peak forward voltage  
0.37  
⎯
I
V
V
V
= 5 V  
RRM  
RRM  
RRM  
RRM  
Repetitive peak reverse current  
Junction capacitance  
mA  
pF  
I
= 30 V  
3.0  
⎯
C
= 10 V, f = 1.0 MHz  
R
130  
j
Device mounted on a ceramic board  
⎯
⎯
60  
(soldering land: 2 mm × 2 mm)  
Thermal resistance  
Thermal resistance  
R
°C/W  
°C/W  
th (j-a)  
Device mounted on a glass-epoxy  
board  
⎯
⎯
⎯
⎯
135  
16  
(soldering land: 6 mm × 6 mm)  
R
⎯
th (j-ℓ)  
1
2006-11-13  
12345

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