CMS05
TOSHIBA Schottky Barrier Rectifier Schottky Barrier Type
CMS05
Switching Mode Power Supply Applications
Unit: mm
Portable Equipment Battery Applications
•
•
•
•
Repetitive peak reverse voltage : V
= 30 V
= 5 A
= 0.45 V (max)
RRM
Average forward current
Peak forward voltage
: I
: V
F (AV)
FM
Suitable for compact assembly due to small surface-mount package
“M−FLATTM” (Toshiba package name)
Absolute Maximum Ratings (Ta = 25°C)
Characteristics
Repetitive peak reverse voltage
Average forward current
Symbol
Rating
30
Unit
V
V
RRM
I
5 (Note 1)
70 (50 Hz)
−40 to 150
−40 to 150
A
F (AV)
Non-repetitive peak forward surge current
Junction temperature
I
A
FSM
T
j
°C
°C
Storage temperature
T
stg
Note 1: Tℓ = 100°C
Device mounted on a ceramic board
Board size : 50 mm × 50 mm
Soldering land size : 2 mm × 2 mm
Board thickness : 0.64 mm
Rectangular waveform (α = 180°), V = 15 V
JEDEC
JEITA
―
―
R
TOSHIBA
3-4E1A
Note : Using continuously under heavy loads (e.g. the application of
high temperature/current/voltage and the significant change in
Weight: 0.023 g (typ.)
temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating
conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
(“Handling Precautions”/Derating Concept and Methods) and individual reliability data (i.e. reliability test
report and estimated failure rate, etc).
Electrical Characteristics (Ta = 25°C)
Characteristics
Symbol
Test Condition
Min
―
―
―
―
―
―
Typ.
0.35
0.40
0.43
6.0
Max
―
Unit
V
V
I
I
I
= 1 A
= 3 A
= 5 A
FM (1)
FM (2)
FM (3)
FM
FM
FM
Peak forward voltage
V
V
―
0.45
―
I
I
V
V
V
= 5 V
RRM (1)
RRM (2)
RRM
RRM
Repetitive peak reverse current
Junction capacitance
μA
= 30 V
65
800
―
C
j
= 10 V, f = 1 MHz
R
330
pF
Device mounted on a ceramic board
board size: 50 mm × 50 mm
soldering land: 2 mm × 2 mm
board thickness: 0.64 mm
―
―
60
R
th (j-a)
Device mounted on a glass-epoxy board
board size: 50 mm × 50 mm
soldering land: 6 mm × 6 mm
board thickness: 1.6 mm
Thermal resistance
°C/W
―
―
―
―
135
16
R
th (j-ℓ)
―
Start of commercial production
2000-07
1
2018-03-15