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CMLDM7003BK PDF预览

CMLDM7003BK

更新时间: 2024-11-19 20:37:19
品牌 Logo 应用领域
CENTRAL 放大器光电二极管晶体管
页数 文件大小 规格书
2页 227K
描述
Small Signal Field-Effect Transistor, 0.3A I(D), 50V, 2-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, ROHS COMPLIANT, PICOMINI-6

CMLDM7003BK 技术参数

是否Rohs认证: 符合生命周期:Active
包装说明:SMALL OUTLINE, R-PDSO-F6针数:6
Reach Compliance Code:compliantECCN代码:EAR99
风险等级:5.57配置:SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE
最小漏源击穿电压:50 V最大漏极电流 (Abs) (ID):0.28 A
最大漏极电流 (ID):0.3 A最大漏源导通电阻:3 Ω
FET 技术:METAL-OXIDE SEMICONDUCTOR最大反馈电容 (Crss):5 pF
JESD-30 代码:R-PDSO-F6JESD-609代码:e3
湿度敏感等级:1元件数量:2
端子数量:6工作模式:ENHANCEMENT MODE
最高工作温度:150 °C封装主体材料:PLASTIC/EPOXY
封装形状:RECTANGULAR封装形式:SMALL OUTLINE
峰值回流温度(摄氏度):260极性/信道类型:N-CHANNEL
最大功率耗散 (Abs):0.35 W认证状态:Not Qualified
子类别:FET General Purpose Power表面贴装:YES
端子面层:Matte Tin (Sn)端子形式:FLAT
端子位置:DUAL处于峰值回流温度下的最长时间:10
晶体管应用:AMPLIFIER晶体管元件材料:SILICON
Base Number Matches:1

CMLDM7003BK 数据手册

 浏览型号CMLDM7003BK的Datasheet PDF文件第2页 
TM  
CMLDM7003  
CMLDM7003G*  
CMLDM7003J  
Central  
Semiconductor Corp.  
TM  
SURFACE MOUNT PICOmini  
DUAL N-CHANNEL  
DESCRIPTION:  
ENHANCEMENT-MODE  
SILICON MOSFET  
These CENTRAL SEMICONDUCTOR devices are dual  
Enhancement-mode N-Channel Field Effect Transistors,  
manufactured by the N-Channel DMOS Process, designed  
for high speed pulsed amplifier and driver applications. The  
CMLDM7003 utilizes the USA pinout configuration, while  
the CMLDM7003J utilizes the Japanese pinout  
configuration. These devices offer low r  
protection up to 2kV.  
and ESD  
DS (ON)  
MARKING CODES: CMLDM7003:  
CMLDM7003G*:  
C30  
C3G  
C3J  
SOT-563 CASE  
Device is Halogen Free by design  
*
CMLDM7003J:  
MAXIMUM RATINGS: (T =25°C)  
SYMBOL  
UNITS  
A
Drain-Source Voltage  
V
50  
50  
12  
280  
1.5  
350  
300  
150  
V
DS  
DG  
GS  
D
DM  
Drain-Gate Voltage  
Gate-Source Voltage  
V
V
I
V
V
mA  
A
mW  
mW  
mW  
°C  
Continuous Drain Current  
Maximum Pulsed Drain Current  
Power Dissipation (Note 1)  
Power Dissipation (Note 2)  
Power Dissipation (Note 3)  
I
P
P
P
D
D
D
Operating and Storage Junction Temperature  
Thermal Resistance  
T , T  
stg  
-65 to +150  
357  
J
Θ
°C/W  
JA  
ELECTRICAL CHARACTERISTICS PER TRANSISTOR: (T =25°C unless otherwise noted)  
A
SYMBOL  
TEST CONDITIONS  
MIN  
TYP  
MAX  
UNITS  
I
I
I
I
, I  
V
V
V
V
V
V
V
V
V
V
V
V
V
V
=5.0V  
=10V  
=12V  
100  
nA  
GSSF GSSR  
GS  
GS  
GS  
DS  
GS  
, I  
2.0  
2.0  
50  
μA  
μA  
nA  
V
V
V
Ω
Ω
Ω
mS  
pF  
pF  
pF  
GSSF GSSR  
, I  
GSSF GSSR  
=50V, V =0V  
DSS  
GS  
BV  
V
V
=0V, I =10μA  
50  
0.49  
DSS  
GS(th)  
SD  
D
=V , I =250μA  
1.0  
1.4  
3.0  
2.5  
2.0  
DS GS  
D
=0V, I =115mA  
=1.8V, I =50mA  
=2.5V, I =50mA  
=5.0V, I =50mA  
=10V, I =200mA  
=25V, V =0, f=1.0MHz  
GS  
=25V, V =0, f=1.0MHz  
GS  
GS  
GS  
GS  
DS  
DS  
DS  
DS  
S
r
r
r
1.6  
1.3  
1.1  
DS(ON)  
DS(ON)  
DS(ON)  
D
D
D
D
g
200  
FS  
C
C
C
5.0  
50  
25  
rss  
iss  
oss  
GS  
GS  
=25V, V =0, f=1.0MHz  
Notes: (1) Ceramic or aluminum core PC Board with copper mounting pad area of 4.0 mm2  
(2) FR-4 Epoxy PC Board with copper mounting pad area of 4.0 mm2  
(3) FR-4 Epoxy PC Board with copper mounting pad area of 1.4 mm2  
R5 (8-January 2009)  

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