WIRE WOUND CHIP COMMON MODE FILTERS
①外观无可见损伤痕迹;
No visible mechanical damage.
②阻抗变化不超过±20%;
Impedance shall not change more than
±20%.
+24
-0
耐高温
High temperature
resistance
在温度-85±2℃的环境中存放 1000
h
6
+24
-0
Component shall be subjected to -85±2℃for 1000
h.
①外观无可见损伤痕迹;
No visible mechanical damage.
+85℃ 30 分钟 ←→ -40℃ 30 分钟,循环 100 次;
+85℃ 30minutes ←→ -40℃ 30minutes 100 Cycles.
温度冲击
②阻抗变化不超过±20%;
Impedance shall not change more than
±20%.
7
Temperature Shock
①外观无可见损伤痕迹;
+24
产品加额定电流在 85±2℃温度条件下存放 1000
-0
h
No visible mechanical damage.
高温负载
②阻抗变化不超过±20%;
Impedance shall not change more than
±20%.
8
+24
-0
shall be store at 85±2℃ for 1000
h with rated current
High temperature load
applied.
+24
-0
①外观无可见损伤痕迹;
在于湿度 90%~95%,温度 60±2℃的环境中存放 1000
No visible mechanical damage.
h
恒定湿热
②阻抗变化不超过±20%;
Impedance shall not change more than
±20%.
9
shall be subjected to 90%~95%RH,at 60±2℃ for 1000
Static Humidity
+24
-0
h
①将电感器安装于试验基板上;在垂直方向施加力(如下图
所示)。Install the inductor on the test substrate; Apply force
in the vertical direction (as shown below).
②该板应在(1±0.5) mm/s 的弯曲速率向下弯曲(2±0.2)
mm,保持时间(20±1)s。The epoxy plate should bend
down to (2±0.2) mm at the bending rate of (1±0.5)
mm/s,Keep time (20±1) sec.
抗弯强度
Bending
strength
外观无可见损伤痕迹;
10
No visible mechanical damage.
4