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CLVC1G32MDCKREPG4 PDF预览

CLVC1G32MDCKREPG4

更新时间: 2024-11-06 12:21:59
品牌 Logo 应用领域
德州仪器 - TI 栅极触发器逻辑集成电路光电二极管输入元件PC
页数 文件大小 规格书
15页 502K
描述
SINGLE 2-INPUT POSITIVE-OR GATE

CLVC1G32MDCKREPG4 技术参数

是否Rohs认证: 符合生命周期:Obsolete
零件包装代码:SOIC包装说明:SC-70, 5 PIN
针数:5Reach Compliance Code:compliant
ECCN代码:EAR99HTS代码:8542.39.00.01
风险等级:5.7Samacsys Confidence:
Samacsys Status:ReleasedSamacsys PartID:605482
Samacsys Pin Count:5Samacsys Part Category:Integrated Circuit
Samacsys Package Category:OtherSamacsys Footprint Name:SOT65P210X110-5N
Samacsys Released Date:2017-01-12 12:59:53Is Samacsys:N
系列:LVC/LCX/ZJESD-30 代码:R-PDSO-G5
JESD-609代码:e4长度:2 mm
负载电容(CL):50 pF逻辑集成电路类型:OR GATE
最大I(ol):0.024 A湿度敏感等级:1
功能数量:1输入次数:2
端子数量:5最高工作温度:125 °C
最低工作温度:-55 °C封装主体材料:PLASTIC/EPOXY
封装代码:TSSOP封装等效代码:TSSOP5/6,.08
封装形状:RECTANGULAR封装形式:SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
包装方法:TAPE AND REEL峰值回流温度(摄氏度):260
电源:3.3 VProp。Delay @ Nom-Sup:5.7 ns
传播延迟(tpd):8 ns认证状态:Not Qualified
施密特触发器:NO座面最大高度:1.1 mm
子类别:Gates最大供电电压 (Vsup):5.5 V
最小供电电压 (Vsup):1.65 V标称供电电压 (Vsup):1.8 V
表面贴装:YES技术:CMOS
温度等级:MILITARY端子面层:Nickel/Palladium/Gold (Ni/Pd/Au)
端子形式:GULL WING端子节距:0.65 mm
端子位置:DUAL处于峰值回流温度下的最长时间:NOT SPECIFIED
宽度:1.25 mmBase Number Matches:1

CLVC1G32MDCKREPG4 数据手册

 浏览型号CLVC1G32MDCKREPG4的Datasheet PDF文件第2页浏览型号CLVC1G32MDCKREPG4的Datasheet PDF文件第3页浏览型号CLVC1G32MDCKREPG4的Datasheet PDF文件第4页浏览型号CLVC1G32MDCKREPG4的Datasheet PDF文件第5页浏览型号CLVC1G32MDCKREPG4的Datasheet PDF文件第6页浏览型号CLVC1G32MDCKREPG4的Datasheet PDF文件第7页 
SN74LVC1G32-EP  
SINGLE 2-INPUT POSITIVE-OR GATE  
www.ti.com  
SCES458DDECEMBER 2003REVISED JUNE 2007  
FEATURES  
Controlled Baseline  
Ioff Supports Partial Power Down Mode  
Operation  
One Assembly/Test Site, One Fabrication  
Site  
Latch-Up Performance Exceeds 100 mA Per  
JESD 78, Class II  
Extended Temperature Performance of –55°C  
to 125°C  
ESD Protection Exceeds JESD 22  
Enhanced Diminishing Manufacturing Sources  
(DMS) Support  
2000-V Human-Body Model (A114-A)  
200-V Machine Model (A115-A)  
Enhanced Product-Change Notification  
1000-V Charged-Device Model (C101)  
(1)  
Qualification Pedigree  
DBV OR DCK PACKAGE  
(TOP VIEW)  
Supports 5-V VCC Operation  
Inputs Accept Voltages to 5.5 V  
Max tpd of 3.6 ns at 3.3 V  
1
2
3
5
4
A
B
V
Y
CC  
Low Power Consumption, 10 μA Max ICC  
±24-mA Output Drive at 3.3 V  
GND  
(1) Component qualification in accordance with JEDEC and  
industry standards to ensure reliable operation over an  
extended temperature range. This includes, but is not limited  
to, Highly Accelerated Stress Test (HAST) or biased 85/85,  
temperature cycle, autoclave or unbiased HAST,  
electromigration, bond intermetallic life, and mold compound  
life. Such qualification testing should not be viewed as  
justifying use of this component beyond specified  
performance and environmental limits.  
DESCRIPTION/ORDERING INFORMATION  
This single 2-input positive-OR gate is designed for 1.65-V to 5.5-V VCC operation.  
Y + A ) B or Y + A B  
The SN74LVC1G32 performs the Boolean function  
in positive logic.  
This device is fully specified for partial power-down applications using Ioff. The Ioff circuitry disables the outputs,  
preventing damaging current backflow through the device when it is powered down.  
ORDERING INFORMATION(1)  
TA  
PACKAGE(2)  
ORDERABLE PART NUMBER  
SN74LVC1G32IDCKREP  
SN74LVC1G32MDCKREP  
SN74LVC1G32MDBVREP  
TOP-SIDE MARKING(3)  
–40°C to 85°C  
SOT (SC-70) – DCK  
SOT (SC-70) – DCK  
Reel of 3000  
Reel of 3000  
CG0  
BYB  
–55°C to 125°C  
SOP (SOT-23) – DBV Reel of 3000  
SBGM  
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI  
website at www.ti.com.  
(2) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at  
www.ti.com/sc/package.  
(3) The actual top-side making has one additional character that designates the wafer fab/assembly site.  
FUNCTION TABLE  
INPUTS  
OUTPUT  
Y
A
H
X
L
B
X
H
L
H
H
L
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas  
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
PRODUCTION DATA information is current as of publication date.  
Copyright © 2003–2007, Texas Instruments Incorporated  
Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  

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