型号 | 品牌 | 获取价格 | 描述 | 数据表 |
CIB10P100 | SAMSUNG |
获取价格 |
Chip Bead For EMI Suppression | |
CIB10P220 | SAMSUNG |
获取价格 |
Chip Bead For EMI Suppression | |
CIB10P260 | SAMSUNG |
获取价格 |
Chip Bead For EMI Suppression | |
CIB10P300 | SAMSUNG |
获取价格 |
Chip Bead For EMI Suppression | |
CIB10P330 | SAMSUNG |
获取价格 |
Chip Bead For EMI Suppression | |
CI-B1608-100JJT | HITACHI |
获取价格 |
General Purpose Inductor, 0.01uH, 5%, 1 Element, Ceramic-Core, SMD | |
CI-B1608-100JPL | HITACHI |
获取价格 |
General Purpose Inductor, 0.01uH, 5%, 1 Element, Ceramic-Core, SMD | |
CI-B1608-120JJB | HITACHI |
获取价格 |
General Purpose Inductor, 0.012uH, 5%, 1 Element, Ceramic-Core, SMD | |
CI-B1608-120JPB | HITACHI |
获取价格 |
General Purpose Inductor, 0.012uH, 5%, 1 Element, Ceramic-Core, SMD | |
CI-B1608-120JPT | HITACHI |
获取价格 |
General Purpose Inductor, 0.012uH, 5%, 1 Element, Ceramic-Core, SMD |