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CH040239R5%N PDF预览

CH040239R5%N

更新时间: 2024-11-28 03:39:23
品牌 Logo 应用领域
威世 - VISHAY /
页数 文件大小 规格书
3页 134K
描述
RESISTOR, THIN FILM, 0.05 W, 5 %, 100 ppm, 39 ohm, SURFACE MOUNT, 0402, CHIP, LEAD FREE

CH040239R5%N 数据手册

 浏览型号CH040239R5%N的Datasheet PDF文件第2页浏览型号CH040239R5%N的Datasheet PDF文件第3页 
CH  
Vishay Sfernice  
Thin Film Microwave Resistors  
FEATURES  
• Small size, down to 20 by 16 mils  
0402 (P)  
• Edged trimmed block resistors  
• Pure alumina substrate (99.5%)  
• Various terminations:  
02016 (P)  
• Pre-tinned over Nickel Barrier (wraparound or flip chip)  
for solder reflow  
• Gold pad for wire (or ribbon) bonding  
• Ohmic range: 10R to 500R  
• Small internal reactance (LC down to 1 x 10- 24  
)
Tolerance 1%, 5%, 10%,  
0402 (B)  
• TCR: 100ppm/°C  
Those miniaturized components are designed in such a way that their internal reactance is very small. When correctly  
mounted and utilized, they function as almost pure resistors on a very large range of frequency, up to 20GHz.  
DIMENSIONS in millimeters [inches]  
ꢄꢅꢆꢇꢈꢉꢊꢇꢄꢋꢆ  
ꢄꢌꢆ  
DIMENSIONS  
CASE SIZE  
A
B
C
D / E  
RATING  
Pn  
POWER  
ELEMENT  
VOLTAGE  
V
LIMITING  
MAX. TOL.  
+ 0.1 (0.004)  
MIN. TOL.  
– 0.1 (0.004)  
02016  
MAX. TOL.  
+ 0.1 (0.004)  
MIN. TOL.  
– 0.1 (0.004)  
0.5 (0.02)  
1.00 (0.040)  
1.27 (0.050)  
1.52 (0.060)  
1.91 (0.075)  
2.54 (0.100)  
3.00 (0.126)  
MAX. TOL.  
+ 0.1 (0.004)  
MIN. TOL.  
ADJUSTABLE  
mW  
– 0.1 (0.004)  
0.4 (0.016)  
0.6 (0.023)  
1.27 (0.050)  
0.75 (0.030)  
1.27 (0.050)  
1.27 (0.050)  
1.60 (0.063)  
0.38 (0.015)  
0.38 (0.015)  
0.38 (0.015)  
0.38 (0.015)  
0.38 (0.015)  
0.38 (0.015)  
0.38 (0.015)  
0.15 (0.006)  
0.38 (0.015)  
0.38 (0.015)  
0.38 (0.015)  
0.38 (0.015)  
0.38 (0.015)  
0.38 (0.015)  
30  
50  
30  
37  
50  
50  
50  
75  
75  
0402  
0505  
0603  
0705/0805  
1005  
125  
125  
200  
250  
330  
1206  
ORDERING INFORMATION  
CH...  
0402  
50R  
1%  
N
SIZE  
02016  
0402  
0505  
0603  
0805  
1005  
1206  
OHMIC VALUE  
10R to 500R  
TOLERANCE  
TERMINATION  
F (Flip Chip): SnAg over nickel  
barrier  
N: (W/A): SnAg over nickel  
barrier  
1%  
5%  
10%  
P: Gold Bonding Pads  
As these products are application dedicated, a Special CH number will be issued for each product after evaluation.  
www.vishay.com  
2
Document Number: 53014  
Revision 08-Mar-05  
For technical questions, contact sfer@vishay.com  

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