Datasheet > CGY2330UH

CGY2330UH

更新时间： 2024-11-22 14:55:51

品牌	Logo	应用领域
MACOM		/
页数	文件大小	规格书
9页	840K
描述
6-Bit, Ku-Band Core Chip

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数据手册

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CGY2330UH 数据手册

6-Bit, Ku-Band Core Chip

13.25 - 14.75 GHz

CGY2330UH/C1

Rev. V1

Features

•

Gain: 5.5 dB

Drain Voltage Supply: 3 V

Drain Current: 16 mA

50 Ω Input & Output Matched

Chip Size: 5.85 x 1.5 mm

Tested, Inspected Known Good Die (KGD)

Space and MIL-STD MMICs

RoHS* Compliant

Applications

•

Radar

Telecommunication

Instrumentation

Description

The CGY2330UH/C1 is a high-performance GaAs

pHEMT MMIC 6-bit Core Chip designed to operate

in the Ku-band.

The die is manufactured using a 180 nm gate length

pHEMT technology (ED02AH). This technology has

been evaluated for space applications and is on

European preferred parts list of the European Space

Agency (ESA).

Ordering Information

Part Number

The pad metallization is gold over titanium/platinum

and compatible with ultrasonic wire bonding. The

minimum gold thickness shall be 1.25 μm.

Package

CGY2330UH/C1

On wafer measured die

* Restrictions on Hazardous Substances, compliant to current RoHS EU directive.

MACOM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.

Visit www.macom.com for additional data sheets and product information.

For further information and support please visit:

https://www.macom.com/support

DC-0029665

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