Datasheet > CG0402MLC-05LG

CG0402MLC-05LG

更新时间： 2024-02-23 15:46:52

品牌	Logo	应用领域
伯恩斯 - BOURNS		/
页数	文件大小	规格书
3页	206K
描述
ChipGuard MLC Series - ESD Protectors

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技术参数
数据手册

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CG0402MLC-05LG 技术参数

是否Rohs认证：	符合	生命周期：	Active
包装说明：	CHIP, 0402	Reach Compliance Code：	compliant
风险等级：	5.74

CG0402MLC-05LG 数据手册

ChipGuard^®MLC Series - ESD Protectors

Product Dimensions

Recommended Pad Layout

(INCHES)

DIMENSIONS:

CG0402

Series

CG0603

Series

CG0402

Series

CG0603

Series

Dimension

Dim.

1.00 0.1ꢀ

1.60 0.ꢁ0

0.ꢀ1

0.76

(0.04 0.006ꢂ

(0.064 0.00ꢃꢂ

(0.0ꢁ0ꢂ

(0.030ꢂ

0.ꢀ0 0.10

0.ꢃ0 0.ꢁ0

0.61

1.0ꢁ

(0.0ꢁ 0.004ꢂ

(0.03ꢁ 0.00ꢃꢂ

(0.0ꢁ4ꢂ

(0.040ꢂ

0.36 0.0ꢀ

0.4ꢀ 0.10

0.ꢀ1

0.ꢀ0

(0.014 0.00ꢁꢂ

(0.01ꢃ 0.004ꢂ

(0.0ꢁ0ꢂ

0.ꢁꢀ 0.1ꢀ

0.30 0.ꢁ0

1.70

ꢁ.ꢀ4

(0.10 0.006ꢂ

(0.01ꢁ 0.00ꢃꢂ

(0.067ꢂ

(0.100ꢂ

Solder Reﬂow Recommendations

Preheat Stages 1-3

Soldering

Cooling

300

250

200

150

100

Stage 1 Preheat

Stage ꢁ Preheat

Stage 3 Preheat

Main Heating

Ambient to Preheating

Temperature

140 °C to 160 °C

Preheat to ꢁ00 °C

30 s to 60 s

60 s to 1ꢁ0 s

ꢁ0 s to 40 s

60 s to 70 s

ꢀꢀ s to 6ꢀ s

ꢀ0 s to 60 s

40 s to ꢀ0 s

30 s to 40 s

ꢀ s

ꢁ00 °C

ꢁ10 °C

ꢁꢁ0 °C

ꢁ30 °C

ꢁ40 °C

ꢁꢀ0 °C to ꢁꢀꢀ °C

Cooling

ꢁ00 °C to 100 °C

1 °C/s to 4 °C/s

110 sec. (min.)

120 sec. (min.)

30-70

sec.

Time (seconds)

•

This product can be damaged by rapid heating, cooling or localized heating.

Heat shocks should be avoided. Preheating and gradual cooling recommended.

Excessive solder can damage the device. Print solder thickness of 1ꢀ0 to ꢁ00 um recommended.

Solder gun tip temperature should be kept below ꢁꢃ0 °C and should not touch the device directly. Contact should be less than 3 seconds.

A solder gun under 30 watts is recommended.

Speciﬁcations are subject to change without notice.

The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.

Users should verify actual device performance in their speciﬁc applications.

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