Datasheet > CEXPRESS-BW-N3010

CEXPRESS-BW-N3010

更新时间： 2024-10-31 02:49:43

品牌	Logo	应用领域
凌华 - ADLINK		/
页数	文件大小	规格书
4页	312K
描述
COM Express Compact Size Type 6 Module

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cExpress-BW

COM Express Compact Size Type 6 Module with

Intel^®Pentium^®, Celeron^®N3000 Series and Atom™ X5-E8000 SoC

New

Features

Dual, quad-core Intel^®Pentium^®, Celeron^®N3000 Series and

●

Atom™ X5-E8000 SoC

●

Up to 8 GB Dual Channel DDR3L at 1600MHz

●

Three DDI channels, one eDP, (shared with DDI3) 3 independent

displays (build option) LVDS in place of eDP

●

Three PCIe x1 (five PCIe x1 with bridge)

●

GbE, two SATA 6 Gb/s (build option onboard SSD),

four USB 3.0/2.0, four USB 2.0

Smart Embedded Management Agent (SEMA^®) functions

●

Speciﬁcations

● Core System

● Ethernet

CPU

MAC/PHY: Intel^®Ethernet Controller i211AT

Interface: 10/100/1000 GbE connection

Dual or quad-core Intel^®Pentium^®, Celeron^®N3000 Series and Atom™ SoC,

14nm process (formerly “Braswell”)

Intel^®Pentium^®N3710, 1.6/2.56 (Burst) GHz, 400/700 (Turbo), 6W (4C)

Intel^®Celeron^®N3160, 1.6/2.24 (Burst) GHz, 320/640 (Turbo), 6W (4C)

Intel^®Celeron^®N3060, 1.6/2.48 (Burst) GHz, 320/600 (Turbo), 6W (2C)

Intel^®Celeron^®N3010, 1.04/2.24 (Burst) GHz, 320/600 (Turbo), 4W (2C)

Intel^®Atom™ X5-E8000, 1.04/2.0 (Burst) GHz, 320

(no Turbo), 5W (4C)

● Video

Supports

3 independent and simultaneous display combinations of DisplayPort/HDMI/

eDP monitors (optional LVDS in place of eDP)

GPU Feature Support

Encode/transcode of HD video content

Memory

Supports 3D rendering, media compositing and video encoding

Dual channel non-ECC 1600/1333 MHz DDR3L memory

up to 8GB in dual SODIMM socket

Full hardware acceleration for decode of HEVC, H.264, SVC, VP8, VP9,

MPEG4, AVS, H.263

Full hardware acceleration for encode of H.264, SVC, VP8, VP9, AVS, H.263

Embedded BIOS

Supports content protection using PAVP2.0, HDCP 1.4/2.1 and Media Vault

DRM

AMI EFI with CMOS backup in 8MB SPI BIOS

Cache

DirectX 11.1 support

2MB for Pentium^®, Celeron^®and Atom™

OpenGL 4.2, ES 3.0 and OpenCL 1.2 support

Note: Availability of features dependent on operating system.

Expansion Busses

3x PCIe x1: Lanes 0/1/2 (build option 5x PCIe x1 with bridge)

LVDS/eDP

eDP support (shared with DDI3)

LPC bus, SMBus (system) , I2C (user)

Single/dual channel 18/24-bit LVDS (build option in place of eDP)

SEMA Board Controller

Supports voltage/current monitoring, power sequence debug support, AT/

ATX mode control, logistics and forensic information, ﬂat panel control,

general purpose I2C, failsafe BIOS (dual BIOS ), watchdog timer and fan

control

Digital Display Interface

DDI1 supporting DisplayPort/HDMI

DDI2 supporting DisplayPort/HDMI

DDI3 supporting DisplayPort/HDMI (shared with LVDS/eDP)

Note: Only two simultaneous HDMI outputs supported.

Debug Headers

40-pin multipurpose ﬂat cable connector for DB-40 debug module providing

BIOS POST code LEDs, BMC access, SPI BIOS ﬂashing, power testpoints,

debug LEDs

60-pin XDP header for ICE debug of CPU

● Audio

Chipset

Intel^®HD Audio integrated in SoC

Audio Codec

On Express-BASE6 carrier (ALC886 standard support)

Note: “Build option” indicates an alternative BOM conﬁguration to support additional or alternative functions that are not available on the standard product.

Be aware that part numbers for SKUs with “build options” will need to be created and may cause production lead times.

12 3 4

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