cExpress-BT
COM Express® Compact Size Type 6 Module with
Intel Atom® E3800 series or Celeron® Processor SoC
Features
Single, dual, quad-core Intel Atom® or Celeron® Processor SoC
●
●
Up to 8GB Dual Channel DDR3L at 1333MHz
●
VGA and two DDI channels (build option LVDS)
●
Three PCIe x1, GbE
●
Two SATA 3Gb/s, one USB 3.0, seven USB 2.0
Supports Smart Embedded Management Agent (SEMA®) functions
●
●
Extreme Rugged operating temperature: -40°C to +85°C
(build option)
Specifications
● Core System
● Video
GPU Feature Support
CPU
Single, dual, quad-core Intel Atom® or Celeron® Processor
7th generation Intel® graphics core architecture with four execution units
supporting two independent displays
Atom® E3845 1.91 GHz 542/792 (Turbo) 10W (4C/1333)
Atom® E3827 1.75 GHz 542/792 (Turbo) 8W (2C/1333)
Atom® E3826 1.46 GHz 533/667 (Turbo) 7W (2C/1066)
Atom® E3825 1.33 GHz 533 (No Turbo) 6W (2C/1066)
Atom® E3815 1.46 GHz 400 (No Turbo) 5W (1C/1066)
Atom® E3805 1.33 GHz (No GFX) 3W (2C/1066)
3D graphics hardware acceleration
Supports DirectX 11, OCL 1.1, OGL ES Halt/2.0/1.1, OGL 3.2
Video decode hardware acceleration including support for H.264, MPEG2,
MVC, VC-1, WMV9 and VP8 formats
Celeron® N2930 1.83/2.16 (Burst) GHz, 313/854 (Turbo) 7.5W (4C/1333)
Celeron® J1900 2.0/2.42 (Burst) GHz, 688/854 (Turbo) 10W (4C/1333)
Video encode hardware acceleration including support for H.264, MPEG2 and
MVC formats
Supports: Single, dual or quad Out-of-Order Execution (OOE) processor
cores, Intel® VT-x, Intel® SSE4.1 and SSE4.2, Intel® 64 architecture, IA 32-bit ,
PCLMULQDQ Instruction DRNG, Intel® Thermal Monitor (TM1 & TM2)
Note: Availability of features may vary between processor SKUs.
Digital Display Interface
DDI1 supporting DisplayPort/HDMI/DVI (build option dual channel 18/24-bit
LVDS support)
DDI2 supporting DisplayPort/HDMI/DVI
Memory
Dual channel non-ECC 1333/1066 MHz DDR3L memory up to 8GB in dual
stacked SODIMM sockets
VGA
Analog VGA supporting resolutions of up to 2560 x 1600 x 24bpp @60
Embedded BIOS
AMI EFI with CMOS backup in 8MB SPI BIOS
● Audio
Chipset
Intel® HD Audio integrated in SoC
Cache
Primary 32 KB, 8-way L1 instruction cache and 24 KB, 6-way L1 write-back
data cache
Audio Codec
Located on carrier Express-BASE6
2MB for E3845, N2930 and J1900
1MB for E3827, E3826, E3825 and E3805
512K for E3815
● Ethernet
Intel® MAC/PHY: Intel® i210LM (MAC/PHY) Ethernet controller
Interface: 10/100/1000 GbE connection
Expansion Busses
3 PCI Express x1 Gen2 (AB): Ianes 0/1/2; build option PCIe x4 (lose GbE)
LPC bus, SMBus (system), I2C (user)
SEMA Board Controller
Supports: Voltage/Current monitoring, Power sequence debug support, AT/
ATX mode control, Logistics and Forensic information, Flat Panel Control,
General Purpose I2C, Failsafe BIOS (dual BIOS), Watchdog Timer and Fan
Control
Debug Headers
40-pin multipurpose flat cable connector
Use in combination with DB-40 debug module
providing BIOS POST code LED, BMC access, SPI BIOS flashing, Power test
points, Debug LEDs
26-pin XDP header for ICE debug of CPU/chipset
Note: “build option” indicates an alternative BOM configuration to support additional or alternative functions that are not available on the standard product.
Be aware that these “build option” part numbers will need to be newly created and this will result in production lead times.