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CES520 PDF预览

CES520

更新时间: 2024-09-24 12:23:03
品牌 Logo 应用领域
东芝 - TOSHIBA 开关
页数 文件大小 规格书
5页 124K
描述
High-Speed Switching

CES520 数据手册

 浏览型号CES520的Datasheet PDF文件第2页浏览型号CES520的Datasheet PDF文件第3页浏览型号CES520的Datasheet PDF文件第4页浏览型号CES520的Datasheet PDF文件第5页 
CES520  
Schottky Barrier Diode Silicon Epitaxial  
CES520  
1. Applications  
High-Speed Switching  
2. Features  
(1) Low reverse current: IR(2) = 5 µA (max)  
(2) Small and compact ESC package, equivalent to SOD-523 and SC-79 packages.  
3. Packaging and Internal Circuit  
1: Cathode  
2: Anode  
ESC  
4. Absolute Maximum Ratings (Note) (Unless otherwise specified, Ta = 25)  
Characteristics  
Symbol  
Note  
Rating  
Unit  
Reverse voltage  
VR  
IFM  
IO  
30  
300  
V
Peak forward current  
mA  
Average rectified current  
Non-repetitive peak forward surge current  
Power dissipation  
200  
IFSM  
PD  
(Note 1)  
(Note 2)  
1
A
mW  
150  
Junction temperature  
Tj  
125  
Storage temperature  
Tstg  
Topr  
-55 to 125  
-40 to 100  
Operating temperature  
Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the  
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even  
if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum  
ratings.  
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook  
("Handling Precautions"/"Derating Concept and Methods") and individual reliability data (i.e. reliability test  
report and estimated failure rate, etc).  
Note 1: Measured with a 10ms pulse.  
Note 2: Mounted on a glass epoxy circuit board of 20 mm × 20 mm, Pad dimension of 4 mm × 4 mm.  
2012-05-24  
Rev.3.0  
1

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