CERAMIC CHIP/MIL-PRF-55681
CAPACITOR OUTLINE DRAWINGS
CHIP DIMENSIONS
“SOLDERGUARD I” *
“SOLDERGUARD II”
TINNED
SOLDER
L
W
T
BW
NICKEL
NICKEL
SILVER
METALLIZATION
SILVER
METALLIZATION
ELECTRODES
ELECTRODES
Military Designation - “S” or “U”
KEMET Designation - “H”
Military Designation - “W” or “Y”
KEMET Designation - “C”
DIMENSIONS—MILLIMETERS AND (INCHES)
KEMET
SIZE
CODE
T
STYLE
L
W
MIN.
MAX.
BW
CDR01
CDR02
CDR03
CDR04
C0805
C1805
C1808
C1812
2.03 .38 ꢀ.080 .015ꢁ
4.57 .38 ꢀ.180 .015ꢁ
4.57 .38 ꢀ.180 .015ꢁ
4.57 .38 ꢀ.180 .015ꢁ
1.27 .38 ꢀ.050 .015ꢁ
1.27 .38 ꢀ.050 .015ꢁ
2.03 .38 ꢀ.080 .015ꢁ
3.18 .38 ꢀ.125 .015ꢁ
.56 ꢀ.022ꢁ
.56 ꢀ.022ꢁ
.56 ꢀ.022ꢁ
.56 ꢀ.022ꢁ
1.40 ꢀ.055ꢁ
1.40 ꢀ.055ꢁ
2.03 ꢀ.080ꢁ
2.03 ꢀ.080ꢁ
.51 0.25 ꢀ.020 .010ꢁ
.51 0.25 ꢀ.020 .010ꢁ
.51 0.25 ꢀ.020 .010ꢁ
.51 0.25 ꢀ.020 .010ꢁ
+.51
4.57
–.38
+.020
.180
–.015
+.51
6.35
–.38
+.020
.250
–.015
CDR05
C1825
.51 ꢀ.020ꢁ
.51 ꢀ.020ꢁ
2.03 ꢀ.080ꢁ
.51 0.25 ꢀ.020 .010ꢁ
ꢀ ꢁ ꢀ ꢁ
CDR06
CDR31
CDR32
CDR33
CDR34
CDR35
C2225
C0805
C1206
C1210
C1812
C1825
5.72 .51 ꢀ.225 .020ꢁ
2.00 .20 ꢀ.078 .008ꢁ
3.20 .20 ꢀ.125 .008ꢁ
3.20 .25 ꢀ.125 .010ꢁ
4.50 .25 ꢀ.176 .010ꢁ
4.50 .30 ꢀ.176 .012ꢁ
6.35 .51 ꢀ.250 .020ꢁ
1.25 .20 ꢀ.04ꢂ .008ꢁ
1.60 .20 ꢀ.062 .008ꢁ
2.50 .25 ꢀ.0ꢂ8 .010ꢁ
3.20 .25 ꢀ.125 .010ꢁ
6.40 .30 ꢀ.250 .012ꢁ
2.03 ꢀ.080ꢁ
1.30 ꢀ.051ꢁ
1.30 ꢀ.051ꢁ
1.50 ꢀ.05ꢂꢁ
1.50 ꢀ.05ꢂꢁ
1.50 ꢀ.05ꢂꢁ
.51 0.25 ꢀ.020 .010ꢁ
.50 0.20 ꢀ.020 .008ꢁ
.50 0.20 ꢀ.020 .008ꢁ
.50 0.25 ꢀ.020 .010ꢁ
.50 0.25 ꢀ.020 .010ꢁ
.50 0.30 ꢀ.020 .012ꢁ
Note: For Solderguard I ꢀMIL-C55681 “S” or “U” Endmetsꢁ, the length, width and thickness positive tolerances ꢀincluding bandwidthꢁ cited above are allowed to increase by the following
amounts:
Length
Width/Thickness
0.38MM ꢀ.015ꢁ
0.38MM ꢀ.015ꢁ
0.30MM ꢀ.012ꢁ
CDR01
CDR02-06
CDR31-35
0.51MM ꢀ.020ꢁ
0.64MM ꢀ.025ꢁ
0.60MM ꢀ.023ꢁ
MIL-PRF-55681 PART NUMBER ORDERING INFORMATION
CDR01
B
P
101
B
K
S M
STYLE & SIZE CODE
STYLE
FAILURE RATE LEVEL ꢀ%/1000 hrs.ꢁ
M — 1.0
P — 0.1
R — 0.01
C— Ceramic
S — 0.001
D— Dielectric, Fixed Chip
R— Established Reliability
TERMINATION FINISH
S — Solder Coated, Final
ꢀSolderGuard Iꢁ
U — Base Metalization—
Barrier Metal—Solder
Coated ꢀSolderGuard Iꢁ
W — Base Metalization—
Barrier Metal—Tinned
Tin or ꢀTin/Lead Alloyꢁ
SolderGuard II
Y — Base Metalization
Barrier Metal—Tinned
ꢀ100% Tinꢁ Solderguard II
RATED TEMPERATURE
–55°C to +125°C
DIELECTRICS
P— 30 PPM/°C—WITH OR WITHOUT ꢃOLTAGE
X— 15%—without voltage
+ 15%, –25%—with voltage
CAPACITANCE TOLERANCE
CAPACITANCE
Expressed in picofarads ꢀpFꢁ.
B
C
D
F
J
K
M
First 2 digits represent significant figures and the last digit specifies the number of zeros to follow.
ꢀUse ꢂ for 1.0 through ꢂ.ꢂpF. Example: 2.2pF = 22ꢂꢁ
.1 pF .25 pF .5 pF
1%
5%
10%
20%
RATED VOLTAGE
A — 50; B — 100
KEMET/MIL-PRF-55681 PART NUMBER EQUIVALENTS
C 0805
P
101
K
1 G M C*
CERAMIC
END METALIZATION
C — SolderGuard II (100% Sn) ꢀMilitary equiv: Y, Wꢁ
H — SolderGuard I (Sn60) ꢀMilitary equiv: S, Uꢁ
SIZE CODE
See Table Above
FAILURE RATE ꢀ%/1,000 hrs.ꢁ
SPECIFICATION
M — 1.0
P — 0.1
R — 0.01
S — 0.001
P-MIL-PRF-55681 = CDR01-CDR06
N-MIL-PRF-55681 = CDR31-CDR35
VOLTAGE TEMPERATURE CHARACTERISTIC
Designated by Capacitance
CAPACITANCE CODE
Expressed in picofarads ꢀpFꢁ.
Change Over Temperature Range
G — BP ꢀC0G/NP0ꢁ ꢀ 30 PPM/°Cꢁ
X — BX ꢀ 15% Without ꢃoltage
First two digits represent significant figures.
Third digit specifies number of zeros. ꢀUse ꢂ
for 1.0 thru ꢂ.ꢂ pF. Example: 2.2 pF –22ꢂꢁ
+15% -25% With ꢃoltageꢁ
CAPACITANCE TOLERANCE
VOLTAGE
1 — 100ꢃ, 5 — 50ꢃ
B
C
D
F
J
K
M
.1 pF .25 pF .5 pF 1% 5% 10% 20%
* Part Number Example: C0805P101K1GMC (14 digits - no spaces)
87
©KEMET Electronics Corporation, P.O. Box 5928, Greenville, S.C. 29606, (864) 963-6300
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