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CDIP

更新时间： 2022-04-23 23:00:11

品牌	Logo	应用领域
AMKOR		/
页数	文件大小	规格书
1页	374K
描述
Ceramic Dual-Inline Package

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数据手册

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CDIP 数据手册

CERAMIC / HERMETIC

data sheet

CDIP / CerDIP

The CDIP offers a variety of features:

Ceramic Dual-Inline Package

Features:

(CDIP / CerDIP)

• 300 mil package body width with lead counts

from 8L to 28L

Amkor Technology is committed to continuing to

service this long established standard industry

package. The Amkor Technology CDIP capability

provides a wide range of lead counts and body

sizes. The CDIP is a hermetic package consisting of

two pieces of dry pressed ceramic surrounding a

"DIP formed" leadframe. The ceramic / LF /

ceramic system is held together hermetically by

frit glass reflowed at temperatures between

400° - 460° Centigrade.

• 400 mil package body width with lead counts

of 22L & 24L

• 600 mil package body width with lead counts

from 24L to 40L

• 100 mil lead pitch

• High thermal conductive ceramic

• Matte Tin lead finish

• JEDEC standard compliant

• Wide selection of available cavity sizes to meet

most die size needs

• Commercial or full Military flows

Applications:

Along with the other standard industry packages,

the CDIP has a proven track record and is still

being used by semiconductor technologies such as:

Digital to Analog converters, EPROMS, Air bag

sensors, Logic, Memory, Microcontrollers, and

Video controllers. Some end applications are:

Military electronics, Commercial electronics,

Automotive and Telecommunications.

VISIT AMKOR TECHNOLOGY ONLINE FOR LOCATIONS AND

TO VIEW THE MOST CURRENT PRODUCT INFORMATION

.

DS801

Rev Date: 08’02

www.amkor.com

1

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