是否无铅: | 不含铅 | 是否Rohs认证: | 符合 |
生命周期: | Active | 零件包装代码: | SOIC |
包装说明: | SOP, SOP16,.3 | 针数: | 16 |
Reach Compliance Code: | compliant | HTS代码: | 8542.39.00.01 |
Factory Lead Time: | 6 weeks | 风险等级: | 5.57 |
其他特性: | ALSO OPERATES WITH 2V TO 10V (VCC-VEE) SUPPLY | 模拟集成电路 - 其他类型: | DIFFERENTIAL MULTIPLEXER |
标称带宽: | 200 MHz | 最大输入电压: | 6 V |
最小输入电压: | JESD-30 代码: | R-PDSO-G16 | |
JESD-609代码: | e4 | 长度: | 10.3 mm |
湿度敏感等级: | 1 | 负电源电压最大值(Vsup): | -6 V |
负电源电压最小值(Vsup): | 标称负供电电压 (Vsup): | -4.5 V | |
正常位置: | NC | 信道数量: | 2 |
功能数量: | 1 | 端子数量: | 16 |
标称断态隔离度: | 67 dB | 通态电阻匹配规范: | 5 Ω |
最大通态电阻 (Ron): | 130 Ω | 最高工作温度: | 125 °C |
最低工作温度: | -55 °C | 输出: | COMMON OUTPUT |
封装主体材料: | PLASTIC/EPOXY | 封装代码: | SOP |
封装等效代码: | SOP16,.3 | 封装形状: | RECTANGULAR |
封装形式: | SMALL OUTLINE | 峰值回流温度(摄氏度): | 260 |
电源: | 2/6,GND/-6 V | 认证状态: | Not Qualified |
座面最大高度: | 1.95 mm | 最大信号电流: | 0.025 A |
子类别: | Multiplexer or Switches | 最大供电电流 (Isup): | 0.16 mA |
最大供电电压 (Vsup): | 6 V | 最小供电电压 (Vsup): | 2 V |
标称供电电压 (Vsup): | 4.5 V | 表面贴装: | YES |
最长断开时间: | 38 ns | 最长接通时间: | 46 ns |
切换: | BREAK-BEFORE-MAKE | 技术: | CMOS |
温度等级: | MILITARY | 端子面层: | Nickel/Palladium/Gold (Ni/Pd/Au) |
端子形式: | GULL WING | 端子节距: | 1.27 mm |
端子位置: | DUAL | 处于峰值回流温度下的最长时间: | NOT SPECIFIED |
宽度: | 5.3 mm | Base Number Matches: | 1 |
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