生命周期: | Active | 零件包装代码: | DIP |
包装说明: | CERDIP-16 | 针数: | 16 |
Reach Compliance Code: | not_compliant | HTS代码: | 8542.39.00.01 |
Factory Lead Time: | 16 weeks | 风险等级: | 5.23 |
Samacsys Confidence: | 3 | Samacsys Status: | Released |
Samacsys PartID: | 12166190 | Samacsys Pin Count: | 16 |
Samacsys Part Category: | Integrated Circuit | Samacsys Package Category: | Dual-In-Line Packages |
Samacsys Footprint Name: | J (R-GDIP-T16) | Samacsys Released Date: | 2020-06-04 09:23:00 |
Is Samacsys: | N | 其他特性: | ALSO OPERATES WITH 2V TO 10V (VCC-VEE) SUPPLY |
模拟集成电路 - 其他类型: | SPST | 标称带宽: | 200 MHz |
最大输入电压: | 6 V | 最小输入电压: | |
JESD-30 代码: | R-GDIP-T16 | 长度: | 19.56 mm |
负电源电压最大值(Vsup): | -5 V | 负电源电压最小值(Vsup): | -1 V |
标称负供电电压 (Vsup): | -4.5 V | 正常位置: | NO |
信道数量: | 4 | 功能数量: | 4 |
端子数量: | 16 | 标称断态隔离度: | 62 dB |
通态电阻匹配规范: | 5 Ω | 最大通态电阻 (Ron): | 170 Ω |
最高工作温度: | 125 °C | 最低工作温度: | -55 °C |
输出: | SEPARATE OUTPUT | 封装主体材料: | CERAMIC, GLASS-SEALED |
封装代码: | DIP | 封装等效代码: | DIP16,.3 |
封装形状: | RECTANGULAR | 封装形式: | IN-LINE |
峰值回流温度(摄氏度): | NOT SPECIFIED | 电源: | 2/6,GND/-6 V |
认证状态: | Not Qualified | 座面最大高度: | 4.57 mm |
最大信号电流: | 0.025 A | 子类别: | Multiplexer or Switches |
最大供电电流 (Isup): | 0.32 mA | 最大供电电压 (Vsup): | 5 V |
最小供电电压 (Vsup): | 1 V | 标称供电电压 (Vsup): | 4.5 V |
表面贴装: | NO | 最长断开时间: | 34 ns |
最长接通时间: | 34 ns | 切换: | BREAK-BEFORE-MAKE |
技术: | CMOS | 温度等级: | MILITARY |
端子形式: | THROUGH-HOLE | 端子节距: | 2.54 mm |
端子位置: | DUAL | 处于峰值回流温度下的最长时间: | NOT SPECIFIED |
宽度: | 6.92 mm | Base Number Matches: | 1 |
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