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CD4011BMJ-MIL PDF预览

CD4011BMJ-MIL

更新时间: 2024-11-25 13:02:51
品牌 Logo 应用领域
德州仪器 - TI /
页数 文件大小 规格书
13页 524K
描述
IC,LOGIC GATE,QUAD 2-INPUT NAND,CMOS,DIP,14PIN,CERAMIC

CD4011BMJ-MIL 技术参数

是否Rohs认证: 不符合生命周期:Obsolete
包装说明:DIP, DIP14,.3Reach Compliance Code:unknown
风险等级:5.92JESD-30 代码:R-XDIP-T14
JESD-609代码:e0逻辑集成电路类型:NAND GATE
端子数量:14最高工作温度:125 °C
最低工作温度:-55 °C封装主体材料:CERAMIC
封装代码:DIP封装等效代码:DIP14,.3
封装形状:RECTANGULAR封装形式:IN-LINE
电源:5/15 V认证状态:Not Qualified
施密特触发器:NO筛选级别:MIL-STD-883 Class B (Modified)
子类别:Gates表面贴装:NO
技术:CMOS温度等级:MILITARY
端子面层:Tin/Lead (Sn/Pb)端子形式:THROUGH-HOLE
端子节距:2.54 mm端子位置:DUAL
Base Number Matches:1

CD4011BMJ-MIL 数据手册

 浏览型号CD4011BMJ-MIL的Datasheet PDF文件第2页浏览型号CD4011BMJ-MIL的Datasheet PDF文件第3页浏览型号CD4011BMJ-MIL的Datasheet PDF文件第4页浏览型号CD4011BMJ-MIL的Datasheet PDF文件第5页浏览型号CD4011BMJ-MIL的Datasheet PDF文件第6页浏览型号CD4011BMJ-MIL的Datasheet PDF文件第7页 
The CD4011B, CD4012B, and CD4023B types  
are supplied in 14-lead hermetic dual-in-line  
ceramic packages (F3A suffix), 14-lead  
dual-in-line plastic packages (E suffix), 14-lead  
small-outline packages (M, MT, M96, and NSR  
suffixes), and 14-lead thin shrink small-outline  
packages (PWR suffix). The CD4011B and  
CD4023Btypes also are supplied in 14-lead thin  
shrink small-outline packages (PW suffix).  
Copyright 2003, Texas Instruments Incorporated  

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