5秒后页面跳转
CD2520FC-0.101 PDF预览

CD2520FC-0.101

更新时间: 2022-04-23 23:00:11
品牌 Logo 应用领域
RHOPOINT /
页数 文件大小 规格书
2页 554K
描述
Low Resistance Chip down to 0.010 OHM at +- with unique Pedestal Terminal Designl for Current Sense in Hybrid and SMT Applications

CD2520FC-0.101 数据手册

 浏览型号CD2520FC-0.101的Datasheet PDF文件第2页 
Type CD Low Resistance Precision Chip Resistors  
Page 1 of 2  
Low Resistance Chip down to 0.010  
at 1% with unique Pedestal Terminal Design  
±
for Current Sense in Hybrid and SMT Applications  
Type CD Low Resistance Precision Chip Resistors utilize the proven  
Caddock Micronox® resistance films to achieve the unique low resistance  
range in this family. The special performance features of the Type CD  
Low Resistance Precision Film Resistor include:  
Style FC - Flip Chip version for surface mount applications.  
Style WB - Wire Bond version for hybrid applications with metallized  
back surface for solder down heat sinking of the chip, includes  
bondable terminatipedestals to receive aluminum wire bonds  
Resistance as low as 0.010 ohm at ±1%.  
Pedestal terminals in this design provide an ultra low resistance  
connection pad which maintains the precision 0.010Ω ±1% at the  
point of customer Kelvin connection to the resistor chip. The pedestal  
terminal with its copper core also provides heat spreading which  
enhances the high power handling capability.  
Thermal resistance is provided to optimize high power designs when  
utilizing higher thermal conductivity circuit board substrates such as IMS or Alumina.  
High pulse handling and overload capability.  
Low inductance provides excellent high frequency and pulse response.  
Style FC - Flip Chip Version is a surface mount version with solderable pedestal terminals for flip chip soldering.  
Power Capability Information  
Resistance  
Dimensions in inches and (millimeters)  
General Applications High Power Applications  
Comments  
Thermal Resistance -  
Film (J) to Solder Pad (C)  
R
Max. Chip  
Temperature  
Power Rating  
θJC  
Model  
at 70° C  
Min.  
Max.  
0.20  
0.20 Ω  
A
B
C
D
(see note 1)  
(see note 2)  
.200 ±.012  
(5.08 ±.30  
.150 ±.012  
(3.81 ±.30)  
.063 ±.006  
(1.60 ±.15)  
.062 min.  
(1.57 min.)  
.078 min.  
(1.98 min.)  
CD2015FC  
CD2520FC  
0.010  
0.010 Ω  
1.0 Watt  
12.0°C/Watt  
9.0°C/Watt  
150°C  
150°C  
Solderable Pedestal  
Solderable Pedestal  
.250 ±.012  
.200 ±.012  
.063 ±.006  
1.5 Watts  
(6.35 ±.30)  
(5.08 ±.30)  
(1.60 ±.15  
Style FC Derating Curve For General Application  
100  
Note 1: General Applications - The power rating for  
general applications is based upon 0.5 sq. in. (300  
mm2) of termination pad or trace area (2 oz. copper)  
connected to each end of the resistor. Maximum chip  
temperature is 150°C. Use Derating Curve to derate  
appropriately for the maximum ambient temperature  
and for the temperature limitations of the adjacent  
materials.  
CD2015FC Standard Resistance Values:  
Tolerance CD2015FC ±1% Standard.  
80  
60  
40  
0.010  
0.015 Ω  
0.020 Ω  
0.025 Ω  
0.030 Ω  
0.033 Ω  
0.040 Ω  
0.050 Ω  
0.075 Ω  
0.10 Ω  
0.20 Ω  
20  
0
CD2520FC Standard Resistance Values:  
Tolerance CD2520FC ±1% Standard.  
25  
70  
100  
150  
0.010  
0.015 Ω  
0.020 Ω  
0.025 Ω  
0.030 Ω  
0.033 Ω  
0.040 Ω  
0.050 Ω  
0.075 Ω  
0.10 Ω  
0.20 Ω  
AMBIENT TEMPERATURE, oC  
Note 2: Thermal Resistance - In High Power Applications where the circuit board material  
provides high heat sinking benefits (such as IMS, Alumina, or other) the thermal resistance of  
the chip resistor is useful to establish the maximum power capability of the chip resistor in the  
application. The film temperature is measured at the center of the resistor element and solder  
pad temperature at the center of the solderable pedestal (point X in the recommended circuit  
layouts shown below). Maximum temperature of the chip resistor (at the center of chip)  
Custom resistance values and non-standard tolerances  
can be manufactured for high quantity applications.  
Please contact Caddock Applications Engineering.  
should not exceed 150°C through the temperature range of the application  
.
Recommended Circuit Board Layout  
(current and sense connections):  
C
C
Note: Actual width of current trace is based on  
magnitudeofcurrent. Pointof connectionshould  
be in the area shown.  
Fig. 1A: Recommended Kelvin layout.  
X
X
C = Current connection  
S = Sense connection  
S
S
Applications Engineering  
Sales and Corporate Office  
17271 North Umpqua Hwy.  
Roseburg, Oregon 97470-9422  
Phone: (541) 496-0700  
Fax: (541) 496-0408  
1717 Chicago Avenue  
Riverside, California 92507-2364  
Phone: (951) 788-1700  
CADDOCK  
e-mail: caddock@caddock.com • web: www.caddock.com  
For Caddock Distributors listed by country see caddock.com/contact/dist.html  
Fax: (951) 369-1151  
Hurst Green Surrey RH8 9AX UK  
Email sales@rhopointcomponents.com  
Web www.rhopointcomponents.com  
UK & Ireland  
Distributors  
Tel: +44 (0) 870 608 1188  
© 2004 Caddock Electronics, Inc.  

与CD2520FC-0.101相关器件

型号 品牌 描述 获取价格 数据表
CD2520WBA RHOPOINT Low Resistance Chip down to 0.010 OHM at +- with unique Pedestal Terminal Designl for Curr

获取价格

CD2520WBA-0.101 RHOPOINT Low Resistance Chip down to 0.010 OHM at +- with unique Pedestal Terminal Designl for Curr

获取价格

CD2535H1 JSMC TO-220S-B

获取价格

CD2535T1 JSMC TO-220S-B

获取价格

CD25C34D15-L27-YF FOXCONN Interconnection Device

获取价格

CD25K100 OHMITE Resistor, Wire Wound, 100ohm, 625V, 10% +/-Tol, -260,260ppm/Cel,

获取价格