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CD-02-05-025 PDF预览

CD-02-05-025

更新时间: 2024-11-24 22:58:15
品牌 Logo 应用领域
其他 - ETC /
页数 文件大小 规格书
3页 346K
描述
THERM PAD 25.4MMX25.4MM ORANGE

CD-02-05-025 数据手册

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ulTIMiFlux Dielectric Phase Change Thermal Material  
CD-02-05  
60oC/140oF PHASE-CHANGE TEMPERATURE  
FEATURES AND BENIFITS  
Low Thermal Impedance  
Excellent Replacement for Thermal Greases  
Thixotropic / Prevents Compound Run-Out  
Excellent Mechanical & Dielectric Properties  
Cost Effective “Drop in Place” Solution  
RoHS and Halogen Free Compliant  
Wakefield-Vette's ulTIMiFlux line of thermal interface materials offer high performance, low cost,  
configurability and custom sizes for your thermal system needs. Thermal Interface Materials (TIM) are  
a secondary material installed between the heat sink and the device which are designed to improve the  
thermal transfer to the heat sink. Regardless of how flat or smooth the device and heat sink are, there  
will always be small air voids between the two surfaces. Since air is a not a great conductor of heat, a  
TIM replaces the air and fills the voids. There are many types of TIMs and each has its best case  
usages. Wakefield-Vetts’s line of dielectric phase change thermal materials are intended to fill voids  
between a device and the heat sink and utilizes a polyimide film to act as a thermally conductive carrier  
in order to deliver a uniform thickness coating of phase-change thermal compound on both sides.  
Through the development of this unique formulation,  
Wakefield-Vette’s phase change solution offers  
efficient thermal transfer by phase-changing during  
normal device operating temperatures while  
maintaining a uniform bond line thus driving out the  
air and adjusting for any surface imperfections or  
flatness conditions that may exist across the interface.  
This construction is useful in a wide range of  
electronic cooling applications from transistors,  
diodes or any type of heat generating non-isolated  
power device.  
Standard Phase Change Pad Construction  
Phase Change Compound  
Polyimide Substrate Carrier  
Phase Change Compound  
A primary advantage of utilizing a phase-  
change system is the ability to drive out air  
from within the interface during initial device  
cycling causing phase change and surface  
wetting of the thermal compound coating.  
The phase-change compound is available in  
specific die cut patterns for common TO  
packages and can be placed instantly and  
immediately ready for component mounting.  
Due to it’s thixotropic formulation design,  
compound is held within the interface with no  
worries of run-out into unwanted areas during  
normal device/component operation.  
www.wakefield-vette.com  

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