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CCM03-3001 PDF预览

CCM03-3001

更新时间: 2024-02-24 09:32:10
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CCM03 MK II

CCM03-3001 数据手册

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1136 ITT - CCM Catalog 11/20/00 12:28 PM Page 29  
CCM03 MK II  
A new range of CCM03 connectors  
Construction  
have been developed to interface with  
SIM/SAM cards as dened by GSM11-  
11 and ENV1375-1. The connectors are  
available with either hinged covers or  
xed covers and have been designed to  
minimize the amount of space needed  
for PCB mounting.  
Contacts  
Plating  
Copper alloy  
Contact area : Gold alloy inlay  
Terminals : Tin lead (2µ min)  
High temp. thermoplastic UL 94V-0 rated  
Stainless steel  
Moldings  
Spring  
Mechanical data  
Features  
Number of Contacts  
6 or 8  
Mechanical life, hinged cover  
Mechanical life, xed cover  
Durability of inlay, hinged cover  
Durability of inlay, fixed cover  
Card insertion force  
10,000 cycles min  
50,000 cycles  
10,000 cycles min (see note 1)  
5,000 cycles  
Hinged cover: 1 N max  
Fixed cover: 3 N max  
Hinged Cover  
Available with 6 or 8 contacts, with or  
without PCB locating pegs.  
Available with card presence switch.  
• The cover springs open when  
unlocked while the card is in place.  
Card extraction force  
Hinged cover: 1 N max  
Fixed cover: 0.80 N min / 3 N max  
Contact force  
Slide locking force  
Vibration  
0.25 N min / 0.50 N max  
2 N min / 6 N max  
• The molding is polarized so that the  
cover can only be closed if the card is  
correctly inserted.  
Frequency 10 to 500 Hz. Acceleration 50m/s2  
Duration 6 hours - amplitude 0.35 mm  
Max electrical discontinuity 1µs  
• The cover can be replaced without  
removing the connector from the PCB  
Shock  
Peak value 500 m/s2 – Duration 11 ms  
3 shocks in each direction of each axis  
Max electrical discontinuity 1 µs  
Inspection slots allow an electrical test  
to be made without opening the cover.  
Electrical data  
• The overall height of the connector is  
only 2.5 mm. The amount of space  
needed to mount the connector is just  
29.65 mm x 17.2 mm  
Insulation resistance  
Contact resistance max  
Switching current  
Dielectric strength  
1,000 Mmin  
100 mmax  
10 µA min / 1 A max  
750 Vrms min  
Fixed Cover  
Environmental data  
Available with 6 or 8 contacts.  
Operating temperature  
Soldering temperature  
-40°C to +85°C  
Temperature/time prole acc. to CECC00802  
para. 6.1, Fig. 3 with peak temperature 250°C  
IEC 512 test number 11c (10 days)  
IEC 512 test number 11f (96 hours)  
• The overall height of the connector is  
2.85 mm max. Only 25.5 mm x 17.2  
mm of board space is required to  
mount the connector.  
Damp heat  
Salt mist  
General  
Note 1: Inlay (precious metal) rating is based on a very abrasive card being used and is  
intended to represent worst case.  
• With tape and reel packaging as  
standard, the connectors are designed  
to be automatically pick-and-placed.  
• The high temperature thermoplastic  
moldings are suited for infrared and  
convection soldering processes.  
• By using an inlay nish in the contact  
area the life of the precious metal is  
extended by over 10 times that of  
standard gold plating.  
• Robustly formed printed circuit tails  
allow a co-planarity of ±0.05 mm to  
be maintained.  
Dimensions are shown in mm  
Dimensions subject to change  
www.ittcannon.com/ccm  
27  

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