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CC3200R1M2RGCR PDF预览

CC3200R1M2RGCR

更新时间: 2024-11-07 01:05:51
品牌 Logo 应用领域
德州仪器 - TI 无线外围集成电路
页数 文件大小 规格书
71页 2694K
描述
CC3200 SimpleLink™ Wi-Fi® and Internet-of-Things Solution, a Single-Chip Wireless MCU

CC3200R1M2RGCR 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Active包装说明:HVQCCN,
Reach Compliance Code:compliantECCN代码:5A992.C
HTS代码:8542.31.00.01Factory Lead Time:6 weeks
风险等级:1.69具有ADC:YES
其他特性:HAVING 40MHZ CRYSTAL FREQUENCY WITH +/-20PPM ACCURACY.地址总线宽度:
位大小:32DAC 通道:NO
DMA 通道:YES外部数据总线宽度:
JESD-30 代码:S-PQCC-N64JESD-609代码:e4
长度:9 mm湿度敏感等级:3
I/O 线路数量:27端子数量:64
片上程序ROM宽度:8最高工作温度:85 °C
最低工作温度:-40 °CPWM 通道:YES
封装主体材料:PLASTIC/EPOXY封装代码:HVQCCN
封装形状:SQUARE封装形式:CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
峰值回流温度(摄氏度):260RAM(字节):262144
ROM(单词):65536ROM可编程性:FLASH
座面最大高度:1 mm速度:80 MHz
最大供电电压:3.6 V最小供电电压:2.1 V
标称供电电压:3.3 V表面贴装:YES
技术:CMOS温度等级:INDUSTRIAL
端子面层:Nickel/Palladium/Gold (Ni/Pd/Au)端子形式:NO LEAD
端子节距:0.5 mm端子位置:QUAD
处于峰值回流温度下的最长时间:NOT SPECIFIED宽度:9 mm
uPs/uCs/外围集成电路类型:MICROCONTROLLER, RISCBase Number Matches:1

CC3200R1M2RGCR 数据手册

 浏览型号CC3200R1M2RGCR的Datasheet PDF文件第2页浏览型号CC3200R1M2RGCR的Datasheet PDF文件第3页浏览型号CC3200R1M2RGCR的Datasheet PDF文件第4页浏览型号CC3200R1M2RGCR的Datasheet PDF文件第5页浏览型号CC3200R1M2RGCR的Datasheet PDF文件第6页浏览型号CC3200R1M2RGCR的Datasheet PDF文件第7页 
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CC3200  
SWAS032F JULY 2013REVISED FEBRUARY 2015  
CC3200 SimpleLink™ Wi-Fi® and Internet-of-Things Solution, a Single-Chip Wireless MCU  
1 Device Overview  
1.1 Features  
1
Programming Interfaces (APIs)  
8 Simultaneous TCP or UDP Sockets  
2 Simultaneous TLS and SSL Sockets  
• CC3200 SimpleLink Wi-Fi—Consists of  
Applications Microcontroller, Wi-Fi Network  
Processor, and Power-Management Subsystems  
• Wi-Fi CERTIFIED™ Chip  
– Powerful Crypto Engine for Fast, Secure Wi-Fi  
and Internet Connections with 256-Bit AES  
Encryption for TLS and SSL Connections  
• Applications Microcontroller Subsystem  
– ARM® Cortex®-M4 Core at 80 MHz  
– Embedded Memory  
– Station, AP, and Wi-Fi Direct® Modes  
– WPA2 Personal and Enterprise Security  
RAM (Up to 256KB)  
External Serial Flash Bootloader, and  
Peripheral Drivers in ROM  
– SimpleLink Connection Manager for  
Autonomous and Fast Wi-Fi Connections  
– SmartConfig™ Technology, AP Mode, and  
WPS2 for Easy and Flexible Wi-Fi Provisioning  
– TX Power  
– 32-Channel Direct Memory Access (μDMA)  
– Hardware Crypto Engine for Advanced Fast  
Security, Including  
18.0 dBm @ 1 DSSS  
14.5 dBm @ 54 OFDM  
AES, DES, and 3DES  
SHA2 and MD5  
CRC and Checksum  
– RX Sensitivity  
–95.7 dBm @ 1 DSSS  
–74.0 dBm @ 54 OFDM  
– 8-Bit Parallel Camera Interface  
– 1 Multichannel Audio Serial Port (McASP)  
Interface with Support for Two I2S Channels  
– Application Throughput  
– 1 SD/MMC Interface  
– 2 Universal Asynchronous Receivers and  
Transmitters (UARTs)  
UDP: 16 Mbps  
TCP: 13 Mbps  
• Power-Management Subsystem  
– 1 Serial Peripheral Interface (SPI)  
– 1 Inter-Integrated Circuit (I2C)  
– Integrated DC-DC Supports a Wide Range of  
Supply Voltage:  
– 4 General-Purpose Timers with 16-Bit Pulse-  
Width Modulation (PWM) Mode  
– 1 Watchdog Timer  
VBAT Wide-Voltage Mode: 2.1 to 3.6 V  
VIO is Always Tied with VBAT  
Preregulated 1.85-V Mode  
– 4-Channel 12-Bit Analog-to-Digital Converters  
(ADCs)  
– Up to 27 Individually Programmable, Multiplexed  
GPIO Pins  
– Advanced Low-Power Modes  
Hibernate: 4 µA  
Low-Power Deep Sleep (LPDS): 250 µA  
RX Traffic (MCU Active): 59 mA @  
54 OFDM  
• Dedicated External SPI Interface for Serial Flash  
• Wi-Fi Network Processor Subsystem  
– Featuring Wi-Fi Internet-On-a-Chip™  
– Dedicated ARM MCU  
TX Traffic (MCU Active): 229 mA @  
54 OFDM, Maximum Power  
Idle Connected (MCU in LPDS):  
825 µA @ DTIM = 1  
Completely Offloads Wi-Fi and Internet  
Protocols from the Application Microcontroller  
– Wi-Fi and Internet Protocols in ROM  
– 802.11 b/g/n Radio, Baseband, Medium Access  
Control (MAC), Wi-Fi Driver, and Supplicant  
• Clock Source  
– 40.0-MHz Crystal with Internal Oscillator  
– 32.768-kHz Crystal or External RTC Clock  
• Package and Operating Temperature  
– 0.5-mm Pitch, 64-Pin, 9-mm × 9-mm QFN  
– Ambient Temperature Range: –40°C to 85°C  
– TCP/IP Stack  
Industry-Standard BSD Socket Application  
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,  
intellectual property matters and other important disclaimers. PRODUCTION DATA.  
 
 
 
 
 
 

CC3200R1M2RGCR 替代型号

型号 品牌 替代类型 描述 数据表
CC3200R1M2RGC TI

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