Type CC Low Resistance Precision Chip Resistors
Page 1 of 2
• Style FC - Flip Chip version for surface mount applications.
Style WB - Wire Bond version for hybrid applications with metallized back
surface for solder down heat sinking of the chip, includes bondable termination
pads to receive aluminum wire bonds.
• Thermal resistance is provided to optimize high power designs when utilizing
higher thermal conductivity circuit board substrates such as IMS or Alumina.
• Resistance range down to 0.010 ohm at ±5%, 0.050 ohm at ±2%,
and 0.10 ohm at ±1%.
• Low inductance provides excellent high frequency and pulse response
• High pulse handling and overload capability.
• Best choice for switching power supplies, motor speed controls, and high
current sensing applications.
Style FC - Flip Chip Version is a surface mount version with solderable pads for flip chip soldering.
Power Capability Information
Resistance
Dimensions in inches and (millimeters)
General Applications High Power Applications
Comments
Thermal Resistance -
Film (J) to Solder Pad (C)
R
Max. Chip
Temperature
Power Rating
θJC
Model
at 70° C
Min.
Max.
A
B
C
D
(see note 1)
(see note 2)
.150 ±.007
(3.81 ±.18)
.120 ±.007
(3.05 ±.18)
.027 ±.005
(.69 ±.13)
.035 min.
(0.89 min.)
.035 min.
(0.89 min.)
.050 min.
(1.27 min.)
.065 min.
(1.66 min.)
Solder Coated Pads
0.010 Ω
0.020 Ω
0.020 Ω
0.010 Ω
0.025 Ω
0.015 Ω
10.0 Ω
10.0 Ω
0.020 Ω
10.0 Ω
0.75 Watt
0.75 Watt
1.0 Watt
22.7°C/Watt
22.7°C/Watt
16.0°C/Watt
13.0°C/Watt
11.5°C/Watt
150°C
150°C
150°C
150°C
150°C
CC1512FC
.150 ±.007
.120 ±.007
.022 ±.003
Solderable Pads
Solderable Pads
(3.81 ±.18)
(3.05 ±.18)
(.56 ±.08)
.200 ±.007
(5.08 ±.18)
.150 ±.007
(3.81 ±.18)
.027 ±.003
(.69 ±.08)
CC2015FC
CC2520FC
.250 ±.007
.200 ±.007
.032 ±.005
Solder Coated Pads
1.5 Watts
1.5 Watts
(6.35 ±.18)
(5.08 ±.18)
(.81 ±.13)
.250 ±.007
(6.35 ±.18)
.200 ±.007
(5.08 ±.18)
.041 ±.004
(1.04 ±.10)
.040 min.
(1.02 min.)
Solderable Pads
CC1512FC Standard Resistance Values:
Tolerance CC1512FC ±1% Standard (except as noted).
Style FC Derating Curve For General Application
3.30 Ω
4.00 Ω
5.00 Ω
7.50 Ω
8.00 Ω
10.0 Ω
0.010 Ω 5% 0.033 Ω 5%
0.015 Ω 5% 0.040 Ω 5%
0.020 Ω 5% 0.050 Ω 2%
0.025 Ω 5% 0.075 Ω 2%
0.030 Ω 5% 0.10 Ω
0.15 Ω
0.20 Ω
0.25 Ω
0.30 Ω
0.33 Ω
0.40 Ω
0.50 Ω
0.75 Ω
1.00 Ω
1.50 Ω
2.00 Ω
2.50 Ω
3.00 Ω
100
80
Note 1: General Applications - The power rating
for general applications is based upon 0.5 sq. in.
(300 mm2) of termination pad or trace area (2 oz.
copper) connected to each end of the resistor.
Maximum chip temperature is 150°C. Use Derating
Curve to derate appropriately for the maximum
ambient temperature and for the temperature
limitations of the adjacent materials.
60
40
CC2015FC Standard Resistance Values:
Tolerance CC2015FC ±1% Standard (except as noted).
20
0
0.020 Ω 5%
0.025 Ω 5%
0.030 Ω 5%
0.033 Ω 5%
0.040 Ω 5%
0.050 Ω 2%
0.075 Ω 2%
0.10 Ω
0.20 Ω
0.25 Ω
0.30 Ω
0.33 Ω
0.40 Ω
0.50 Ω
0.75 Ω
1.00 Ω
1.50 Ω
2.00 Ω
2.50 Ω
3.00 Ω
3.30 Ω
4.00 Ω
5.00 Ω
7.50 Ω
8.00 Ω
10.0 Ω
25
70
100
150
AMBIENT TEMPERATURE, oC
0.15 Ω
Note 2: Thermal Resistance - In High Power Applications where the circuit board
material provides high heat sinking benefits (such as IMS, Alumina, or other) the thermal
resistance of the chip resistor is useful to establish the maximum power capability of the
chip resistor in the application. The film temperature is measured at the center of the
resistor element and the solder pad temperature is measured at the center of the
termination pad (point X in the recommended circuit layouts shown below). Maximum
temperature of the chip resistor (at the center of chip) should not exceed 150°C through
the temperature range of the application.
CC2520FC Standard Resistance Values:
Tolerance CC2520FC ±1% Standard (except as noted).
3.30 Ω
4.00 Ω
5.00 Ω
7.50 Ω
8.00 Ω
10.0 Ω
0.010 Ω 5% 0.033 Ω 5%
0.015 Ω 5% 0.040 Ω 5%
0.020 Ω 5% 0.050 Ω 2%
0.025 Ω 5% 0.075 Ω 2%
0.030 Ω 5% 0.10 Ω
0.15 Ω
0.75 Ω
1.00 Ω
1.50 Ω
2.00 Ω
2.50 Ω
3.00 Ω
0.20 Ω
0.25 Ω
0.30 Ω
0.33 Ω
0.40 Ω
0.50 Ω
Custom resistance values and non-standard tolerances
can be manufactured for high quantity applications.
Please contact Caddock Applications Engineering.
Recommended Circuit Board Layout
(current and sense connections):
C
C
Fig. 1A: Kelvin layout recom-
mended for values below 0.20Ω
Fig. 1B: Kelvin layout
recommended for higher
resistance values.
C
C
C
X
X
C = Current connection
S = Sense connection
X
X
S
S
S
S
Note: Actualwidthofcurrenttraceisbasedonmagnitudeofcurrent. Pointof connectionshouldbeintheareashown.
Applications Engineering
17271 North Umpqua Hwy.
Roseburg, Oregon 97470-9422
Phone: (541) 496-0700
Fax: (541) 496-0408
Sales and Corporate Office
1717 Chicago Avenue
Riverside, California 92507-2364
Phone: (951) 788-1700
e-mail: caddock@caddock.com • web: www.caddock.com
For Caddock Distributors listed by country see caddock.com/contact/dist.html
Fax: (951) 369-1151
Hurst Green • Surrey • RH8 9AX • UK
Email • sales@rhopointcomponents.com
Web • www.rhopointcomponents.com
UK & Ireland
Distributors
Tel: +44 (0) 870 608 1188
© 2004 Caddock Electronics, Inc.
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