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| 型号 | 品牌 | 获取价格 | 描述 | 数据表 |
| CBC3225T6R8MRV | TAIYO YUDEN |
获取价格 |
Wire-wound Chip Inductors for Automotive |
|
| CBC3225T821KR | TAIYO YUDEN |
获取价格 |
Wire-wound Chip Power Inductors (CB series)[CBC] |
|
| CBC3225T821KR_19 | TAIYO YUDEN |
获取价格 |
Wire-wound Chip Power Inductors (CB series)[CBC] |
|
| CBC3225T821KR8 | TAIYO YUDEN |
获取价格 |
Wire-wound Chip Power Inductors for Telecommunications Infrastructure and Industrial Equip |
|
| CBC3225T821KR8_V01 | TAIYO YUDEN |
获取价格 |
Wire-wound Chip Power Inductors for Telecommunications Infrastructure and Industrial Equip |
|
| CBC3225T821KRV | TAIYO YUDEN |
获取价格 |
Wire-wound Chip Inductors for Automotive |
|
| CBC3225T821MR | TAIYO YUDEN |
获取价格 |
Wire-wound Chip Power Inductors |
|
| CBC3225T821MR_19 | TAIYO YUDEN |
获取价格 |
Wire-wound Chip Power Inductors (CB series)[CBC] |
|
| CBC3225T821MR8 | TAIYO YUDEN |
获取价格 |
Wire-wound Chip Power Inductors for Telecommunications Infrastructure and Industrial Equip |
|
| CBC3225T821MR8_V01 | TAIYO YUDEN |
获取价格 |
Wire-wound Chip Power Inductors for Telecommunications Infrastructure and Industrial Equip |
|
英伟达新AI芯片Rubin或提前半年亮相
苹果iPhone 17将全系采用三星/LG显示LTPO OLED面板
三星深化印度制造布局，供应链本地化进程加速
芯擎科技“星辰一号”自动驾驶芯片点亮成功，2025年量产在即
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