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C450DA1000-0319 PDF预览

C450DA1000-0319

更新时间: 2024-12-01 12:29:31
品牌 Logo 应用领域
科锐 - CREE /
页数 文件大小 规格书
5页 462K
描述
Direct Attach LED Technology Rectangular LED RF Performance

C450DA1000-0319 数据手册

 浏览型号C450DA1000-0319的Datasheet PDF文件第2页浏览型号C450DA1000-0319的Datasheet PDF文件第3页浏览型号C450DA1000-0319的Datasheet PDF文件第4页浏览型号C450DA1000-0319的Datasheet PDF文件第5页 
Direct Attach DA1000™ LEDs  
CxxxDA1000-Sxx000  
Data Sheet  
Cree’sꢀDirectꢀAttachꢀDA1000ꢀLEDsꢀareꢀtheꢀnextꢀgenerationꢀofꢀsolid-stateꢀLEDꢀemittersꢀthatꢀcombineꢀhighlyꢀefficientꢀ  
InGaNꢀmaterialsꢀwithꢀCree’sꢀproprietaryꢀdeviceꢀtechnologyꢀandꢀsilicon-carbideꢀsubstratesꢀtoꢀdeliverꢀsuperiorꢀvalueꢀforꢀ  
thegeneral-illuminationmarket.TheDA1000LEDsareamongthebrightestinthelightingmarketwhiledeliveringꢀ  
alowforwardvoltage,resultinginaverybrightandhighlyefficientsolution.Thebondpad-downdesignallowsforꢀ  
aeutecticdirectdie-attachprocess,eliminatingtheneedforwirebonds,andenablessuperiorperformancefromꢀ  
improvedꢀthermalꢀmanagement.  
FEATURES  
APPLICATIONS  
•ꢀ DirectꢀAttachꢀLEDꢀTechnology  
•ꢀ GeneralꢀIllumination  
−ꢀ Aircraft  
•ꢀ RectangularꢀLEDꢀRFꢀPerformance  
–ꢀ 450ꢀ&ꢀ460ꢀnmꢀ–ꢀ485ꢀmWꢀmin  
−ꢀ DecorativeꢀLighting  
−ꢀ TaskꢀLighting  
•ꢀ HighꢀReliabilityꢀ-ꢀꢀEutecticꢀAttach  
•ꢀ LowꢀForwardꢀVoltageꢀ(Vf)ꢀ–ꢀ3.15ꢀVꢀTypicalꢀatꢀ350ꢀmA  
•ꢀ MaximumꢀDCꢀForwardꢀCurrentꢀ–ꢀ1000ꢀmA  
•ꢀ InGaNꢀJunction-DownꢀDesignꢀforꢀImprovedꢀThermalꢀ  
Management  
−ꢀ OutdoorꢀIllumination  
•ꢀ WhiteꢀLEDs  
•ꢀ CameraꢀFlash  
•ꢀ ProjectionꢀDisplays  
•ꢀ Automotive  
•ꢀ NoꢀWireꢀBondsꢀRequired  
CxxxDA1000-Sxx000 Chip Diagram  
Top View  
Die Cross Section  
Bottom View  
DA1000ꢀLED  
1000ꢀxꢀ1000ꢀμm  
Anodeꢀ(+)  
945ꢀxꢀ75ꢀμmꢀ  
Gapꢀ75ꢀμmꢀ  
Cathodeꢀ(-)  
945ꢀxꢀ795ꢀμm  
tꢀ=ꢀ335ꢀμm  
Subject to change without notice.  
www.cree.com  
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