Datasheet > C3225X5R1H335M250AB_17

C3225X5R1H335M250AB_17

更新时间： 2024-01-08 05:49:34

品牌	Logo	应用领域
东电化 - TDK		/
页数	文件大小	规格书
3页	237K
描述
Multilayer Ceramic Chip Capacitors

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C3225X5R1H335M250AB_17 数据手册

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Creation Date : June 02, 2017 (GMT)

Multilayer Ceramic Chip Capacitors

C3225X5R1H335K250AB

TDK item description C3225X5R1H335KT****

Applications

Commercial Grade

Feature

Series

Status

General General (Up to 50V)

C3225 [EIA 1210]

Production (Not Recommended for New Design)

Size

Length(L)

3.20mm ±0.40mm

Width(W)

2.50mm ±0.30mm

0.20mm Min.

Thickness(T)

Terminal Width(B)

Terminal Spacing(G)

Recommended Land Pattern (PA)

Recommended Land Pattern (PB)

Recommended Land Pattern (PC)

2.00mm to 2.40mm

1.00mm to 1.20mm

1.90mm to 2.50mm

Electrical Characteristics

Capacitance

3.3μF ±10%

50VDC

Rated Voltage

Temperature Characteristic

Dissipation Factor (Max.)

Insulation Resistance (Min.)

X5R(±15%)

151MΩ

Other

Soldering Method

AEC-Q200

Reﬂow

Packing

Blister (Plastic)Taping [180mm Reel]

1000pcs

Package Quantity

! Images are for reference only and show exemplary products.

! This PDF document was created based on the data listed on the TDK Corporation website.

! All speciﬁcations are subject to change without notice.

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