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C30616BFC-04-ST PDF预览

C30616BFC-04-ST

更新时间: 2024-10-28 23:39:11
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其他 - ETC 光电
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6页 285K
描述
Optoelectronic

C30616BFC-04-ST 数据手册

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High-Speed InGaAs PIN  
Photodiodes  
Description  
EVERYTHING  
IN A  
High-speed InGaAs photodiodes from  
PerkinElmer Optoelectronics are  
designed for use in OEM fiber optic  
communications systems and high-  
speed receiver applications including  
trunk line, LAN, fiber-in-the-loop and  
data communications. Ceramic  
submount packages are available for  
easy integration into high-speed  
SONET, FDDI, or datalink receiver  
modules, or as back-facet power  
monitors in laser diode modules.  
C30616, C30637, C30617, C30618  
NEW  
LIGHT.  
Photodiodes are available in hermetic  
TO-18 packages, or in connectorized  
receptacle packages with industry  
standard ST, FC or SC connectors.  
These are designed for mating to either  
single or multimode fibers. Photodiodes  
are also available in a fibered package  
with either single or multimode fiber  
pigtail, which can be terminated with  
either an ST, FC or SC connector.  
Receptacled and fibered packages use  
a ball-lens TO-18 package to maximize  
coupling efficiency. All devices are  
planar passivated and feature proven  
high reliability mounting and contacting.  
An MTTF of >109 hours (approximate-  
ly 105 years) at 50oC has been  
demonstrated with an extended high temperature burn-  
in at 200oC for 168 hours (VR = 10V), ensuring an  
MTTF > 107 hours at 50oC (E = 0.7eV). Finally, all  
A
production devices are screened with a 16 hour, 200oC  
burn-in (VR = 10V) and tested to meet responsivity,  
spectral noise and dark current specifications.  
Features  
demonstrated to date from standard  
production samples.  
50, 75, 100, 350 µm diameters  
High responsivity at 1300 and 1550nm  
Low capacitance for high bandwidths (to 3.5GHz)  
Available in various package options  
Quality and Reliability  
PerkinElmer Optoelectronics is  
committed to supplying the highest  
quality product to our customers, and  
we are certified to meet ISO-9001 and  
operate to MIL-Q-9858A and AQAP-1  
quality standards. Process control is  
maintained through annual re-  
Applications  
High-speed communications  
SONET/ATM, FDDI  
Datalinks & LANs  
qualification of production units and  
includes extensive electrical, thermal  
and mechanical stress as well as an  
extended lifetest. In addition, every  
wafer lot is individually qualified to meet  
responsivity, capacitance and dark  
current specifications, and reliability is  
Fiber optic sensors  

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