Datasheet > C30616BFC-04-FC

C30616BFC-04-FC

更新时间： 2024-10-28 23:39:11

品牌	Logo	应用领域
其他 - ETC		光电
页数	文件大小	规格书
6页	285K
描述
Optoelectronic

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C30616BFC-04-FC 数据手册

High-Speed InGaAs PIN

Photodiodes

Description

EVERYTHING

IN A

High-speed InGaAs photodiodes from

PerkinElmer Optoelectronics are

designed for use in OEM fiber optic

communications systems and high-

speed receiver applications including

trunk line, LAN, fiber-in-the-loop and

data communications. Ceramic

submount packages are available for

easy integration into high-speed

SONET, FDDI, or datalink receiver

modules, or as back-facet power

monitors in laser diode modules.

C30616, C30637, C30617, C30618

NEW

LIGHT.

Photodiodes are available in hermetic

TO-18 packages, or in connectorized

receptacle packages with industry

standard ST, FC or SC connectors.

These are designed for mating to either

single or multimode fibers. Photodiodes

are also available in a fibered package

with either single or multimode fiber

pigtail, which can be terminated with

either an ST, FC or SC connector.

Receptacled and fibered packages use

a ball-lens TO-18 package to maximize

coupling efficiency. All devices are

planar passivated and feature proven

high reliability mounting and contacting.

An MTTF of >10⁹hours (approximate-

ly 105 years) at 50^oC has been

demonstrated with an extended high temperature burn-

in at 200^oC for 168 hours (V^R= 10V), ensuring an

MTTF > 10⁷hours at 50^oC (E = 0.7eV). Finally, all

production devices are screened with a 16 hour, 200^oC

burn-in (V^R= 10V) and tested to meet responsivity,

spectral noise and dark current specifications.

Features

demonstrated to date from standard

production samples.

• 50, 75, 100, 350 µm diameters

• High responsivity at 1300 and 1550nm

• Low capacitance for high bandwidths (to 3.5GHz)

• Available in various package options

Quality and Reliability

PerkinElmer Optoelectronics is

committed to supplying the highest

quality product to our customers, and

we are certified to meet ISO-9001 and

operate to MIL-Q-9858A and AQAP-1

quality standards. Process control is

maintained through annual re-

Applications

• High-speed communications

• SONET/ATM, FDDI

• Datalinks & LANs

qualification of production units and

includes extensive electrical, thermal

and mechanical stress as well as an

extended lifetest. In addition, every

wafer lot is individually qualified to meet

responsivity, capacitance and dark

current specifications, and reliability is

• Fiber optic sensors

12 3 4 5 6

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