F E AT U R E S
C Series
•ꢀMinimumꢀassemblyꢀcostꢀandꢀlaborꢀSpringꢀClipsꢀ
make the mounting holes, fasteners, tools and
fixtures obsolete in assembly operations & reduce
costs.
TO-126, TO-247, TO-220
and TO-264 Package Heatsinks
•ꢀMaximumꢀThermalꢀTransferꢀMaximumꢀsurfaceꢀareaꢀ
per unit volume, efficient cooling fins & consistent
mounting force reduces thermal resistance.
•ꢀMaximumꢀRepeatabilityꢀConstantꢀspringꢀforceꢀoverꢀ
repeated assembly/disassembly.
•ꢀMaximumꢀReliabilityꢀResilientꢀspringꢀactionꢀlocksꢀ
electronic component in place. Fewer parts in
assembly and no fasteners and washers required.
Prevent short circuit by eliminating metal particles
generated from hardware or thread tapping.
Ohmite introduces the C series (Pat. Pending). This
series offers high performance, low cost and a
compact heat sink with an integrated camming clip
system for TO-126, TO-220, TO-247 and TO-264
devices. This powerful heat sink provides tool and
fixture free assembly operation, largest surface areas •ꢀDesignꢀFlexibilityꢀMaximumꢀflexibilityꢀforꢀdynamicꢀ
and smallest space occupation. It is the ideal type of
heat sink for high power density and small size (1U
or 2U) electronic packaging with forced convection
cooling.
device locations and power upgrading. “Configure-
to-Fit” gives designers total freedom to configure
heat sink needed to fit into a multitude design envi-
ronments.
SERꢀES SPECꢀFꢀCATꢀONS
ChARACTERꢀSTꢀCS
Surface
Aluminum Alloy 6063-T5 or Equivalent
with either degreased or black anod-
ized finish.
Heat Sink
Heatsink
Area
Weight Length “L”
Part Number
C247-025
C247-050
C247-075
C264-030
C264-058
C264-085
C220-025
C220-050
C220-075
C126-025
(in2/mm2)
(oz/g)
(mm)
25
50
75
30
58
85
25
50
75
25
40
50
75
11 / 7,312
23 / 14,858
34 / 21,655
13 / 8,774
25 / 16,963
37 / 24,861
11 / 7,312
23 / 14,858
34 / 21,655
0.5 / 15
1.1 / 31
1.6 / 45
0.7 / 19
1.35 / 37
1.97 / 54
0.5 / 15
1.1 / 31
1.6 / 45
Music Wire, Per ASTM A228 with
bright nickel plating
Spring Clip
Solder Foot
Cold-rolled Steel, Per ASTM A-366
with pure tin over copper strike. RoHS
compliant.
for improvement, use thermal joint
compound, 0.005 Grafoil (TGon 800
by Laird), or phase change material
(Hi-Flow by Bergquist)
Interface
Thermal
Resistance
10.2 / 6,559 0.45 / 12.7
C126-040 16.3 / 10,495 0.72 / 20.3
C126-050 20.4 / 13,119 0.90 / 25.4
C126-075 30.6 / 21,655 1.35 / 38.1
(Optional) Sil-Pad 900-S, K6 800-S
and K10 by Bergquist
Insulator
hEAT DꢀSSꢀPATꢀON
HeatꢀdissipationꢀisꢀtheꢀtotalꢀforꢀALLꢀDEVICESꢀattachedꢀtoꢀheatsink.
Air Velocity (ft./min.)
Air Velocity (ft./min.)
200
140
400
600
800
1000
200
38
400
600
800
1000
9
C247-025-1AE (1 device)
C247-050-2AE (2 devices)
C247-075-3AE (3 devices)
TO-126/CE-S102 (25mm long)
one device w/Sil-pad 900s
12
10
8
8
7
6
5
4
3
2
1
0
36
34
32
30
28
26
24
22
120
100
80
60
40
20
0
6
4
0
5
10
15
2
3
4
5
6
7
8
9
10
Heat Dissipated, total for ALL devices (watts)
Total Heat Dissipated (watts)
(continued)
1-866-9-OHMITE • Int’l 1-847-258-0300 • Fax 1-847-574-7522 • www.ohmite.com • info@ohmite.com
168
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