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Creation Date : April 24, 2017 (GMT)
Multilayer Ceramic Chip Capacitors
C1608JB1H104M080AA
TDK item description C1608JB1H104MT****
Applications
Commercial Grade
Feature
Series
Status
General General (Up to 50V)
C1608 [EIA 0603]
Production (Not Recommended for New Design)
Size
Length(L)
1.60mm ±0.10mm
Width(W)
0.80mm ±0.10mm
0.80mm ±0.10mm
0.20mm Min.
Thickness(T)
Terminal Width(B)
Terminal Spacing(G)
0.30mm Min.
0.70mm to 1.00mm(Flow Soldering)
0.60mm to 0.80mm(Reflow Soldering)
Recommended Land Pattern (PA)
Recommended Land Pattern (PB)
Recommended Land Pattern (PC)
0.80mm to 1.00mm(Flow Soldering)
0.60mm to 0.80mm(Reflow Soldering)
0.60mm to 0.80mm(Flow Soldering)
0.60mm to 0.80mm(Reflow Soldering)
Electrical Characteristics
Capacitance
100nF ±20%
50VDC
Rated Voltage
Temperature Characteristic
Dissipation Factor (Max.)
Insulation Resistance (Min.)
JB(±10%)
2.5%
5000MΩ
Other
Wave (Flow)
Reflow
Soldering Method
AEC-Q200
No
Packing
Punched (Paper)Taping [180mm Reel]
4000pcs
Package Quantity
! Images are for reference only and show exemplary products.
! This PDF document was created based on the data listed on the TDK Corporation website.
! All specifications are subject to change without notice.
Copyright(c) TDK Corporation. All rights reserved.