Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Open Mode Design (FO-CAP), X7R Dielectric,
16 – 200 VDC (Commercial & Automotive Grade)
Overview
KEMET’s Ceramic Open Mode capacitor in X7R dielectric
is designed to significantly minimize the probability of a
low IR or short circuit condition when forced to failure in
a board stress flex situation, thus reducing the potential
for catastrophic failure. The Open Mode capacitor may
experience a drop in capacitance; however, a short is
unlikely because a crack will not typically propagate
across counter electrodes within the device’s “active area.”
Since there will not be any current leakage associated
with a typical Open Mode flex crack, there is no localized
heating and therefore little chance for a catastrophic and
potentially costly failure event.
circuit failures. Although flexible termination technology
does not eliminate the potential for mechanical damage that
may propagate during extreme environmental and handling
conditions, it does provide superior flex performance over
standard termination systems. When combined with flexible
termination technology these devices offer the ultimate level
of protection against a low IR or short circuit condition. Open
Mode devices compliment KEMET's Floating Electrode
(FE-CAP) and Floating Electrode with Flexible Termination
(FF-CAP) product lines by providing a fail-safe design
optimized for mid to high range capacitance values. These
devices exhibit a predictable change in capacitance with
respect to time and voltage and boast a minimal change
in capacitance with reference to ambient temperature.
Capacitance change is limited to ±15% from −55°C to +125°C.
Driven by the demand for a more robust and reliable
component, the Open Mode capacitor was designed for
critical applications where higher operating temperatures
and mechanical stress are a concern. These capacitors
are widely used in automotive circuits as well as power
supplies (input and output filters) and general electronic
applications.
Concerned with flex cracks resulting from excessive
tensile and shear stresses produced during board flexure
and thermal cycling? These devices are available with
KEMET's Flexible termination technology which inhibits the
transfer of board stress to the rigid ceramic body, therefore
mitigating flex cracks which can result in low IR or short
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Ordering Information
C
1210
J
685
K
3
R
A
C
TU
Rated
Voltage Dielectric
(VDC)
Failure
Rate/
Design
Case Size Specification/
Capacitance
Code (pF)
Capacitance
Tolerance
Packaging/Grade
Ceramic
Termination Finish1
(L" x W")
Series
(C-Spec)
0805
1206
1210
1812
F = Open Mode Two significant K = ±10%
J = Open Mode digits + number M = ±20%
4 = 16
R = X7R A = N/A C = 100% Matte Sn
L = SnPb
See "Packaging
C-Spec
Ordering
Options Table"
below
3 = 25
5 = 50
1 = 100
2 = 200
withꢀFlexible
of zeros
(5% Pb minimum)
Termination
1 Additional termination finish options may be available. Contact KEMET for details.
1 SnPb termination finish option is not available on automotive grade product.
One world. One KEMET
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
C1012_X7R_OPENMODE_SMD • 11/29/2017
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