Datasheet > C1206C829C1GAC

C1206C829C1GAC

更新时间： 2024-11-04 19:39:03

品牌	Logo	应用领域
基美 - KEMET		电容器
页数	文件大小	规格书
9页	1072K
描述
Capacitor, Ceramic, Chip, General Purpose, 8.2pF, 100V, ±0.25pF, C0G/NP0, 1206 (3216 mm), Sn/NiBar, -55º ~ +125ºC, Bulk

阅读下载

中文翻译

获取价格

技术参数
数据手册

如果您发现信息不准确，欢迎纠错

C1206C829C1GAC 技术参数

是否无铅：	不含铅	是否Rohs认证：	符合
生命周期：	Active	零件包装代码：	1206
包装说明：	, 1206	Reach Compliance Code：	compliant
ECCN代码：	EAR99	HTS代码：	8532.24.00.20
风险等级：	5.38	电容：	0.0000082 µF
电容器类型：	CERAMIC CAPACITOR	介电材料：	CERAMIC
高度：	0.78 mm	JESD-609代码：	e3
长度：	3.2 mm	安装特点：	SURFACE MOUNT
多层：	Yes	负容差：	3.0488%
端子数量：	2	最高工作温度：	125 °C
最低工作温度：	-55 °C	封装形状：	RECTANGULAR PACKAGE
封装形式：	SMT	包装方法：	TR, EMBOSSED PLASTIC/PAPER, 7/13 INCH
正容差：	3.0488%	额定（直流）电压（URdc）：	100 V
尺寸代码：	1206	表面贴装：	YES
温度特性代码：	C0G	温度系数：	30ppm/Cel ppm/ °C
端子面层：	Matte Tin (Sn) - with Nickel (Ni) barrier	端子形状：	WRAPAROUND
宽度：	1.6 mm	Base Number Matches：	1

C1206C829C1GAC 数据手册

CERAMIC CHIP CAPACITORS

FEATURES

• C0G (NP0), X7R, X5R, Z5U and Y5V Dielectrics

• Tape and reel packaging per EIA481-1. (See page

92 for specific tape and reel information.) Bulk

Cassette packaging (0402, 0603, 0805 only) per

IEC60286-6 and EIAJ 7201.

• 10, 16, 25, 50, 100 and 200 Volts

• Standard End Metalization: Tin-plate over nickel

barrier

• Available Capacitance Tolerances: 0.10 pFꢁ 0.25

pFꢁ 0.5 pFꢁ 1ꢀꢁ 2ꢀꢁ 5ꢀꢁ 10ꢀꢁ 20ꢀꢁ and

+80ꢀ-20ꢀ

• RoHS Compliant

CAPACITOR OUTLINE DRAWINGS

TIN PLATE

NICKEL PLATE

CONDUCTIVE

METALLIZATION

ELECTRODES

DIMENSIONS—MILLIMETERS AND (INCHES)

EIA SIZE

CODE

METRIC

SIZE CODE

MOUNTING

TECHNIQUE

L - LENGTH

W - WIDTH

B - BANDWIDTH

SEPARATION

minimum

THICKNESS

0201*

0402*

0603

0805*

1206*

1210*

1808

1812

1825*

2220

2225

0603

1005

1608

2012

3216

3225

4520

4532

4564

5650

5664

0.6 (.024) ± .03 (.001)

1.0 (.04) ± .05 (.002)

1.6 (.063) ± .15 (.006)

2.0 (.079) ± .20 (.008)

3.2 (.126) ± .20 (.008)

4.5 (.177) ± .30 (.012)

5.6 (.220) ± .40 (.016)

0.3 ± (.012) ± .03 (.001)

0.5 (.02) ± .05 (.002)

0.8 (.032) ± .15 (.006)

1.25 (.049) ± .20 (.008)

1.6 (.063) ± .20 (.008)

2.5 (.098) ± .20 (.008)

2.0 (.079) ± .20 (.008)

3.2 (.126) ± .30 (.012)

6.4 (.252) ± .40 (.016)

5.0 (.197) ± .40 (.016)

6.3 (.248) ± .40 (.016)

0.15 (.006) ± .05 (.002)

0.20 (.008) -.40 (.016)

0.35 (.014) ± .15 (.006)

0.50 (.02) ± .25 (.010)

0.60 (.024) ± .35 (.014)

N/A

0.3 (.012)

0.7 (.028)

0.75 (.030)

N/A

Solder Reflow

Solder Wave +

Solder Reflow

See page 78

for thickness

dimensions.

N/A

Solder Reflow

N/A

* Note: Indicates EIA Preferred Case Sizes (Tightened tolerances apply for 0402, 0603, and 0805 packaged in bulk bassette, see page 96.)

+ For extended value 1210 case size - solder reflow only.

(Standard Chips - For

Military see page 87)

CAPACITOR ORDERING INFORMATION

C 0805 C 103 K 5 R A C*

CERAMIC

END METALLIZATION

SIZE CODE

C-Standard (Tin-plated nickel barrier)

SPECIFICATION

C - Standard

FAILURE RATE LEVEL

CAPACITANCE CODE

A- Not Applicable

Expressed in Picofarads (pF)

First two digits represent significant figures.

Third digit specifies number of zeros. (Use 9

for 1.0 through 9.9pF. Use 8 for 0.5 through 0.99pF)

(Example: 2.2pF = 229 or 0.50 pF = 508)

CAPACITANCE TOLERANCE

B – 0.10pF J – 5ꢀ

TEMPERATURE CHARACTERISTIC

Designated by Capacitance

Change Over Temperature Range

G – C0G (NP0) ( 30 PPMꢂ/C)

R – X7R ( 15ꢀ) (-55/C + 125/C)

P– X5R ( 15ꢀ) (-55/C + 85/C)

U – Z5U (+22ꢀ, -56ꢀ) (+10/C + 85/C)

C – 0.25pF K – 10ꢀ

V – Y5V (+22ꢀ, -82ꢀ) (-30/C + 85/C)

D – 0.5pF

F – 1ꢀ

G – 2ꢀ

M – 20ꢀ

P – (GMV) – special order only

Z – +80ꢀ, -20ꢀ

VOLTAGE

1 - 100V 3 - 25V

1 - 100V

3 - 25V

2 - 200V 4 - 16V

5 - 50V 8 - 10V

6 - 35V 9 - 6.3V

7 - 4V

* Part Number Example: C0805C103K5RAC (14 digits - no spaces)

7 - 4V

9 - 6.3V

12 3 4 5 6 7...9

中文翻译

下载PDF

与C1206C829C1GAC相关器件

型号	品牌	获取价格	描述	数据表
C1206C829C1GAC7800	KEMET	获取价格	Capacitor, Ceramic, Chip, General Purpose, 8.
C1206C829C1GACTU	KEMET	获取价格	Capacitor, Ceramic, Chip, General Purpose, 8.
C1206C829C3GAC7411	KEMET	获取价格	Ceramic Capacitor, Multilayer, Ceramic, 25V, 3.0488% +Tol, 3.0488% -Tol, C0G, -/+30ppm/Cel
C1206C829C4GAC7025	KEMET	获取价格	Ceramic Capacitor, Multilayer, Ceramic, 16V, 3.0488% +Tol, 3.0488% -Tol, C0G, -/+30ppm/Cel
C1206C829C4GAC7411	KEMET	获取价格	Ceramic Capacitor, Multilayer, Ceramic, 16V, 3.0488% +Tol, 3.0488% -Tol, C0G, -/+30ppm/Cel
C1206C829C8GAC7025	KEMET	获取价格	Ceramic Capacitor, Multilayer, Ceramic, 10V, 3.0488% +Tol, 3.0488% -Tol, C0G, -/+30ppm/Cel
C1206C829D1GAC	VISHAY	获取价格	Ceramic Capacitor, Multilayer, Ceramic, 100V, 6.0976% +Tol, 6.0976% -Tol, C0G, 0.0000082uF
C1206C829D1GAC7411	KEMET	获取价格	Ceramic Capacitor, Multilayer, Ceramic, 100V, 6.0976% +Tol, 6.0976% -Tol, C0G, -/+30ppm/Ce
C1206C829D5GACTU	KEMET	获取价格	Ceramic, Commercial-(CxxxxC), 8.2 pF, /-0.5 pF, 50 V, 1206, C0G, SMD, MLCC, Ultra-Stable,
C1206C829J1GAC7800	KEMET	获取价格	Ceramic Capacitor, Multilayer, Ceramic, 100V, C0G, -/+30ppm/Cel TC, 0.0000082uF, 1206

与C1206C829C1GAC相关文章

英伟达新AI芯片Rubin或提前半年亮相
2024-11-05

13
苹果iPhone 17将全系采用三星/LG显示LTPO OLED面板
2024-11-05

7
三星深化印度制造布局，供应链本地化进程加速
2024-10-29

34
芯擎科技“星辰一号”自动驾驶芯片点亮成功，2025年量产在即
2024-10-29

30

产品中心

服务支持

精选活动

关于我们

帮助中心

C1206C829C1GAC

C1206C829C1GAC 技术参数

C1206C829C1GAC 数据手册

与C1206C829C1GAC相关器件

与C1206C829C1GAC相关文章

您还可以找

产品中心

服务支持

精选活动

关于我们

帮助中心

C1206C829C1GAC

C1206C829C1GAC 技术参数

C1206C829C1GAC 数据手册

与C1206C829C1GAC相关器件

与C1206C829C1GAC相关文章

您还可以找

您在本页遇到什么问题？