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C-BMJ-0102 PDF预览

C-BMJ-0102

更新时间: 2024-11-19 06:46:27
品牌 Logo 应用领域
FCI-CONNECTOR 连接器
页数 文件大小 规格书
1页 139K
描述
8 POL SHALLOW LATCH CONNECTOR

C-BMJ-0102 数据手册

  
1
2
3
4
15.30 0.25  
PRODUCT NO. 54602 - X08 LF  
A
A
B
C
D
LEAD FREE  
SHALLOW LATCH  
SERIES  
PLATING CODE  
2 0.076µ Au Selective  
6 0.76µ Au Selective  
7 Au Flash Selective  
8 1.27µ Au Selective  
9 0.38µ Au Selective  
9F 0.38µ Au Throughout  
SCALE 2:1  
17.74 0.20  
12.05+00.20  
CAVITY NO.  
PCB LAYOUT  
8.89  
2.54  
B
1.27TYP  
0.76  
FCI LOGO  
4.20  
2.54  
0.46  
6.45  
7.62  
Y
11.43  
X
3.20 0.10  
TECHNICAL SPECIFICATION:  
11.43  
C Insulation Resistance - 500 M Ohms min.  
Dielectric Strength - 1000 V rms , 60 Hz.  
Contact Resistance - 20 mOhms. max.  
NOTES:  
1. ALL WIRES MUST BE CONTAINED IN THE SHELF.  
3.24  
Current Rating - 1.5 amp DC  
Maximum Total Mating Force - 35 N  
Retention Force Between Plug & Jack-22.5 N min.  
Durability - 250 Cycles Min. except Plating Code 2 & 7  
Temperature Range -40/+70°C  
1.LF Products meet European Union Directives and other country  
Regulations as described in GS-22-008.  
2.The Housing will withstand exposure to 260' peak temperature for  
5 sec in a wave solder applicotion with a 1.6mm Min thick circuit board  
Slight deformation of snap pegs may occur at 260-265'c which will not  
affect the function of the product.  
3.Lead Free or ROHS Directive labelling to be provided as per GS-14-920  
for Lead Free version.  
MATERIAL  
-Housing: Glassfilled Polyester-UL94 V0 BLACK  
1.27  
0.25 X Y  
2.54  
The housing will withstand exposure to 260-265'C for  
5 seconds in a wavesoldering application.Use protective  
adhesive tape(Kapton or Teflon) or protective metallic devices  
on the areas which are directly exposed to wave soldering  
as it is used in classical leaded wave soldering.  
projection  
size  
surface  
-
tolerance std  
mm  
www.fciconnect.com  
TOLERANCES UNLESS OTHERWISE SPECIFIED  
0.X  
0.3  
0.15  
0.05  
Dr  
Eng  
Chr  
Appr  
MINI KV  
2003-04-11  
Scale  
ANGULAR  
rev  
D
ecn no  
dr  
date  
D
A3  
0.XX  
3:1  
LINEAR  
HIRAN V.  
NEBU PM  
2003-04-11  
2010-02-02  
2010-02-02  
I06-0123 HVN 2006-07-21  
I07-0039 HVN 2007-03-16  
I07-0122 HVN 2007-09-19  
I09-0174 NPM 2009-08-24  
I10-0037 NPM 2010-02-02  
0
1
0.XXX  
-Contact: 0.46mm Copper Alloy  
ECN  
E
SUDHIR V.  
Product family  
MODJACK Spec ref  
F
Plating:  
Rev.  
G
Active zone: Gold over nickel on contact area  
Termination zone : Matte Tin over nickel (Lead Free version)  
8 POL SHALLOW LATCH CONNECTOR  
C-BMJ-0102  
H
H
(PCB MODJACK)  
-
-
-
-
-
-
-
-
catalog no  
sheet 1 of 1  
54602 CUSTOMER COPY  
REV F - 2006-04-17  
1
2
3
4
PDM: Rev:H  
STATUS:Released  
Printed: Feb 04, 2010.  

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