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BZX84C56ET3 PDF预览

BZX84C56ET3

更新时间: 2024-09-20 03:02:11
品牌 Logo 应用领域
安森美 - ONSEMI 测试光电二极管
页数 文件大小 规格书
6页 166K
描述
56V, 0.225W, SILICON, UNIDIRECTIONAL VOLTAGE REGULATOR DIODE, TO-236AB, PLASTIC PACKAGE-3

BZX84C56ET3 技术参数

是否无铅: 含铅是否Rohs认证: 不符合
生命周期:Obsolete零件包装代码:SOT-23
包装说明:PLASTIC PACKAGE-3针数:3
Reach Compliance Code:not_compliantECCN代码:EAR99
HTS代码:8541.10.00.50风险等级:5.12
其他特性:UL RECOGNIZED配置:SINGLE
二极管元件材料:SILICON二极管类型:ZENER DIODE
最大动态阻抗:200 ΩJEDEC-95代码:TO-236AB
JESD-30 代码:R-PDSO-G3JESD-609代码:e0
元件数量:1端子数量:3
最高工作温度:150 °C最低工作温度:-65 °C
封装主体材料:PLASTIC/EPOXY封装形状:RECTANGULAR
封装形式:SMALL OUTLINE峰值回流温度(摄氏度):240
极性:UNIDIRECTIONAL最大功率耗散:0.225 W
认证状态:Not Qualified标称参考电压:56 V
子类别:Voltage Reference Diodes表面贴装:YES
技术:ZENER端子面层:Tin/Lead (Sn/Pb)
端子形式:GULL WING端子位置:DUAL
处于峰值回流温度下的最长时间:30最大电压容差:7.14%
工作测试电流:2 mABase Number Matches:1

BZX84C56ET3 数据手册

 浏览型号BZX84C56ET3的Datasheet PDF文件第2页浏览型号BZX84C56ET3的Datasheet PDF文件第3页浏览型号BZX84C56ET3的Datasheet PDF文件第4页浏览型号BZX84C56ET3的Datasheet PDF文件第5页浏览型号BZX84C56ET3的Datasheet PDF文件第6页 
BZX84CxxxET1 Series,  
SZBZX84CxxxET1G Series  
Zener Voltage Regulators  
225 mW SOT23 Surface Mount  
This series of Zener diodes is offered in the convenient, surface  
mount plastic SOT23 package. These devices are designed to provide  
voltage regulation with minimum space requirement. They are well  
suited for applications such as cellular phones, hand held portables,  
and high density PC boards.  
http://onsemi.com  
3
1
Cathode  
Anode  
Specification Features  
3
225 mW Rating on FR4 or FR5 Board  
Zener Breakdown Voltage Range 2.4 V to 75 V  
Package Designed for Optimal Automated Board Assembly  
Small Package Size for High Density Applications  
ESD Rating of Class 3 (>16 kV) per Human Body Model  
Peak Power 225 W (8 X 20 ms)  
AECQ101 Qualified and PPAP Capable  
SZ Prefix for Automotive and Other Applications Requiring Unique  
Site and Control Change Requirements  
1
2
SOT23  
CASE 318  
STYLE 8  
MARKING DIAGRAM  
xxx M G  
PbFree Packages are Available  
Mechanical Characteristics  
G
1
CASE: Void-free, transfer-molded, thermosetting plastic case  
FINISH: Corrosion resistant finish, easily solderable  
MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES:  
260°C for 10 Seconds  
POLARITY: Cathode indicated by polarity band  
FLAMMABILITY RATING: UL 94 V0  
xxx  
M
= Device Code  
= Date Code*  
= PbFree Package  
G
(Note: Microdot may be in either location)  
*Date Code orientation may vary depending  
upon manufacturing location.  
ORDERING INFORMATION  
MAXIMUM RATINGS  
Device  
Package  
Shipping  
Rating  
Symbol  
Max  
Unit  
BZX84CxxxET1  
SOT23  
3000 / Tape &  
Reel  
Peak Power Dissipation @ 20 ms (Note 1)  
P
pk  
225  
W
@ T 25°C  
L
BZX84CxxxET1G  
SOT23  
(PbFree)  
3000 / Tape &  
Reel  
Total Power Dissipation on FR5 Board,  
P
D
(Note 2) @ T = 25°C  
225  
1.8  
mW  
mW/°C  
A
SZBZX84CxxxET1G SOT23  
(PbFree)  
3000 / Tape &  
Reel  
Derated above 25°C  
Thermal Resistance, JunctiontoAmbient  
R
556  
°C/W  
q
JA  
BZX84CxxxET3  
SOT23 10,000 / Tape &  
Reel  
SOT23 10,000 / Tape &  
Total Power Dissipation on Alumina Sub-  
P
D
strate, (Note 3) @ T = 25°C  
300  
2.4  
mW  
mW/°C  
BZX84CxxxET3G  
A
Derated above 25°C  
(PbFree)  
SZBZX84CxxxET3G SOT23 10,000 / Tape &  
(PbFree) Reel  
Reel  
Thermal Resistance, JunctiontoAmbient  
R
417  
°C/W  
°C  
q
JA  
Junction and Storage Temperature Range  
T , T  
J
65 to  
+150  
stg  
†For information on tape and reel specifications,  
including part orientation and tape sizes, please  
refer to our Tape and Reel Packaging Specification  
Brochure, BRD8011/D.  
Stresses exceeding Maximum Ratings may damage the device. Maximum  
Ratings are stress ratings only. Functional operation above the Recommended  
Operating Conditions is not implied. Extended exposure to stresses above the  
Recommended Operating Conditions may affect device reliability.  
1. Nonrepetitive current pulse per Figure 9.  
2. FR5 = 1.0 X 0.75 X 0.62 in.  
3. Alumina = 0.4 X 0.3 X 0.024 in, 99.5% alumina.  
DEVICE MARKING INFORMATION  
See specific marking information in the device marking  
column of the Electrical Characteristics table on page 3 of  
this data sheet.  
© Semiconductor Components Industries, LLC, 2011  
1
Publication Order Number:  
November, 2011 Rev. 7  
BZX84C2V4ET1/D  
 

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