BZX84CxxxET1G Series,
SZBZX84CxxxET1G Series
Zener Voltage Regulators
225 mW SOT−23 Surface Mount
This series of Zener diodes is offered in the convenient, surface
mount plastic SOT−23 package. These devices are designed to provide
voltage regulation with minimum space requirement. They are well
suited for applications such as cellular phones, hand held portables,
and high density PC boards.
http://onsemi.com
Specification Features
225 mW Rating on FR−4 or FR−5 Board
Zener Breakdown Voltage Range − 2.4 V to 75 V
Package Designed for Optimal Automated Board Assembly
Small Package Size for High Density Applications
ESD Rating of Class 3 (> 16 kV) per Human Body Model
Peak Power − 225 W (8 X 20 ms)
SOT−23
CASE 318
STYLE 8
3
1
Cathode
Anode
AEC−Q101 Qualified and PPAP Capable
SZ Prefix for Automotive and Other Applications Requiring Unique
Site and Control Change Requirements
MARKING DIAGRAM
Pb−Free Packages are Available*
xxx M G
Mechanical Characteristics
G
CASE: Void-free, transfer-molded, thermosetting plastic case
FINISH: Corrosion resistant finish, easily solderable
MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES:
260C for 10 Seconds
POLARITY: Cathode indicated by polarity band
FLAMMABILITY RATING: UL 94 V−0
1
xxx
M
G
= Device Code
= Date Code*
= Pb−Free Package
(Note: Microdot may be in either location)
*Date Code orientation may vary depending
upon manufacturing location.
MAXIMUM RATINGS
Rating
Symbol
Max
Unit
Peak Power Dissipation @ 20 ms (Note 1)
P
pk
225
W
ORDERING INFORMATION
@ T 25C
L
†
Device
Package
Shipping
Total Power Dissipation on FR−5 Board,
P
D
(Note 2) @ T = 25C
225
1.8
556
mW
mW/C
C/W
A
BZX84CxxxET1G
SOT−23
(Pb−Free)
3,000 /
Derated above 25C
Tape & Reel
Thermal Resistance, Junction−to−Ambient
R
q
JA
SZBZX84CxxxET1G SOT−23
(Pb−Free)
3,000 /
Tape & Reel
Total Power Dissipation on Alumina
P
D
Substrate, (Note 3) @ T = 25C
300
2.4
417
mW
mW/C
C/W
A
Derated above 25C
BZX84CxxxET3G
SOT−23
10,000 /
Tape & Reel
Thermal Resistance, Junction−to−Ambient
R
q
(Pb−Free)
JA
Junction and Storage Temperature Range
T , T
−65 to
+150
C
SZBZX84CxxxET3G SOT−23
(Pb−Free)
10,000 /
Tape & Reel
J
stg
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Nonrepetitive current pulse per Figure 9.
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
2. FR−5 = 1.0 X 0.75 X 0.62 in.
DEVICE MARKING INFORMATION
3. Alumina = 0.4 X 0.3 X 0.024 in, 99.5% alumina.
See specific marking information in the device marking
column of the Electrical Characteristics table on page 3 of
this data sheet.
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
Semiconductor Components Industries, LLC, 2012
1
Publication Order Number:
January, 2012 − Rev. 8
BZX84C2V4ET1/D