BZX84CxxxET1 Series,
SZBZX84CxxxET1G Series
Zener Voltage Regulators
225 mW SOT−23 Surface Mount
This series of Zener diodes is offered in the convenient, surface
mount plastic SOT−23 package. These devices are designed to provide
voltage regulation with minimum space requirement. They are well
suited for applications such as cellular phones, hand held portables,
and high density PC boards.
http://onsemi.com
3
1
Cathode
Anode
Specification Features
3
• 225 mW Rating on FR−4 or FR−5 Board
• Zener Breakdown Voltage Range − 2.4 V to 75 V
• Package Designed for Optimal Automated Board Assembly
• Small Package Size for High Density Applications
• ESD Rating of Class 3 (>16 kV) per Human Body Model
• Peak Power − 225 W (8 X 20 ms)
• AEC−Q101 Qualified and PPAP Capable
• SZ Prefix for Automotive and Other Applications Requiring Unique
Site and Control Change Requirements
1
2
SOT−23
CASE 318
STYLE 8
MARKING DIAGRAM
xxx M G
• Pb−Free Packages are Available
Mechanical Characteristics
G
1
CASE: Void-free, transfer-molded, thermosetting plastic case
FINISH: Corrosion resistant finish, easily solderable
MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES:
260°C for 10 Seconds
POLARITY: Cathode indicated by polarity band
FLAMMABILITY RATING: UL 94 V−0
xxx
M
= Device Code
= Date Code*
= Pb−Free Package
G
(Note: Microdot may be in either location)
*Date Code orientation may vary depending
upon manufacturing location.
ORDERING INFORMATION
MAXIMUM RATINGS
†
Device
Package
Shipping
Rating
Symbol
Max
Unit
BZX84CxxxET1
SOT−23
3000 / Tape &
Reel
Peak Power Dissipation @ 20 ms (Note 1)
P
pk
225
W
@ T ≤ 25°C
L
BZX84CxxxET1G
SOT−23
(Pb−Free)
3000 / Tape &
Reel
Total Power Dissipation on FR−5 Board,
P
D
(Note 2) @ T = 25°C
225
1.8
mW
mW/°C
A
SZBZX84CxxxET1G SOT−23
(Pb−Free)
3000 / Tape &
Reel
Derated above 25°C
Thermal Resistance, Junction−to−Ambient
R
556
°C/W
q
JA
BZX84CxxxET3
SOT−23 10,000 / Tape &
Reel
SOT−23 10,000 / Tape &
Total Power Dissipation on Alumina Sub-
P
D
strate, (Note 3) @ T = 25°C
300
2.4
mW
mW/°C
BZX84CxxxET3G
A
Derated above 25°C
(Pb−Free)
SZBZX84CxxxET3G SOT−23 10,000 / Tape &
(Pb−Free) Reel
Reel
Thermal Resistance, Junction−to−Ambient
R
417
°C/W
°C
q
JA
Junction and Storage Temperature Range
T , T
J
−65 to
+150
stg
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Nonrepetitive current pulse per Figure 9.
2. FR−5 = 1.0 X 0.75 X 0.62 in.
3. Alumina = 0.4 X 0.3 X 0.024 in, 99.5% alumina.
DEVICE MARKING INFORMATION
See specific marking information in the device marking
column of the Electrical Characteristics table on page 3 of
this data sheet.
© Semiconductor Components Industries, LLC, 2011
1
Publication Order Number:
November, 2011 − Rev. 7
BZX84C2V4ET1/D