Datasheet > BZX84B11HE3

BZX84B11HE3

更新时间： 2024-12-01 14:52:07

品牌	Logo	应用领域
美微科 - MCC		/
页数	文件大小	规格书
4页	515K
描述
Tape : 3K/Reel, 120K/Ctn;

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中文翻译

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数据手册

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BZX84B11HE3 数据手册

BZX84B4V3HE3 THRU BZX84B36HE3

Features

•

Halogen Free. "Green" Device (Note 1)

AEC-Q101 Qualified

350 mWatt

Zener Diodes

2.4 to 36 Volts

Planar Die Construction

Ideally Suited for Automated Assembly Processes

Moisture Sensitivity Level 1

Epoxy Meets UL 94 V-0 Flammability Rating

Lead Free Finish/RoHS Compliant ("P" Suffix Designates RoHS

Compliant. See Ordering Information)

Maximum Ratings

SOT-23

•

Operating Junction Temperature Range: -55°C to +150°C

Storage Temperature Range: -55°C to +150°C

Thermal Resistance : 357°C/W Junction to Ambient

Symbol

Parameter

Rating

Conditions

Note 2

P_D

Power Dissipation

350mW

Peak Forward

Surge Current

Note 3

I_FSM

2.0A

Maximum Forward

Voltage

I_F=10mA

V_F

0.9V

DIMENSIONS

MIN MAX MIN MAX

INCHES

DIM

NOTE

Note: 1. Halogen free "Green” products are defined as those which contain <900ppm bromine,

<900ppm chlorine (<1500ppm total Br + Cl) and <1000ppm antimony compounds.

2. Mounted on 5.0mm²(.013mm thick) Land Areas.

3. Measured on 8.3ms, Single Half Sine-wave or Equivalent Square Wave

0.110 0.120 2.80 3.04

0.083 0.104 2.10 2.64

0.047 0.055 1.20 1.40

0.034 0.041 0.85 1.05

0.067 0.083 1.70 2.10

0.018 0.024 0.45 0.60

0.01 0.15

0.0004 0.006

Internal Structure

0.035 0.043 0.90 1.10

0.003 0.007 0.08 0.18

0.012 0.020 0.30 0.51

0.020

0.50

0.007

0.20

Suggested Solder Pad Layout

0.031

0.800

0.035

0.900

0.079

2.000

inches

0.037

0.950

0.037

0.950

Rev.3-3-10282020

1/4

MCCSEMI.COM

12 3 4

中文翻译

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