Datasheet > BZX584C3

BZX584C3

更新时间： 2024-09-27 14:53:47

品牌	Logo	应用领域
强茂 - PANJIT		/
页数	文件大小	规格书
6页	520K
描述
SOD-523

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中文翻译

获取价格

数据手册

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BZX584C3 数据手册

BZX584C2V4 SERIES

SURFACE MOUNT SILICON ZENER DIODES

POWER

VOLTAGE

200 mWatt

2.4 to 75 Volt

FEATURES

• Planar die construction

0.050(1.25)

0.045(1.15)

• 200mW power dissipation

• Zener voltages from 2.4V~75V

0.014(0.35)

0.009(0.25)

• Ideally suited for automated assembly processes

• Lead free in compliance with EU RoHS 2.0

0.034(0.85)

0.029(0.75)

0.026(0.65)

0.021(0.55)

• Green molding compound as per IEC 61249 standard

0.006(0.15)

0.002(0.05)

0.067(1.70)

0.059(1.50)

MECHANICAL DATA

• Case: SOD-523, Plastic

0.20 MIN.

• Terminals: Solderable per MIL-STD-750, Method 2026

• Standard packaging: 8mm tape

• Apporx. Weight: 0.00005 ounces, 0.00143 grams

MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS

PARAMETER

SYMBOL

VALUE

UNITS

Forward Voltage @I_F=10mA

0.9

Power Dissipation@TA=25^oC(Note A)

200

Operating Junction and Storage Temperature Range

-55 to +150

NOTES :

A. Mounted on 100cm²(1mm thick) copper areas.

PAGE . 1

January 15,2021

BZX584C2V4_SERIES-REV.06

12 3 4 5 6

中文翻译

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